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Solar cell texturing

A patterning and wafer technology, applied in the field of solar cells, can solve the problems of fragility, inability to meet the minimum line width specification, and provide sufficient vertical gap, and achieve the effect of long working life

Inactive Publication Date: 2015-03-18
PALO ALTO RES CENT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional mask printing techniques such as inkjet, screen printing, or flexographic printing cannot meet the minimum line width specifications, and newer techniques such as microcontact printing, dip pen nanolithography (DNP, using AFM-type probes as writing tip) or other MEMS methods are too slow, fragile or do not provide sufficient vertical clearance over large areas

Method used

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  • Solar cell texturing
  • Solar cell texturing
  • Solar cell texturing

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Embodiment Construction

[0031] The present invention relates to improvements in methods of printing mask patterns for producing light-trapping structures on polysilicon wafers during the production of low-cost solar cells. The following description is provided to enable one of ordinary skill in the art to make and use the invention presented in the context of a particular application and its requirements. When used herein, directional terms such as "upper," "lower," "downward," "front," "rear" are intended to provide relative positions for purposes of description, and are not intended to designate an absolute frame of reference. Additionally, the phrases "integrally connected" and "integrally molded" are used herein to describe a connection relationship between two parts of a single molded or machined structure, and are not to be confused with the terms "connected" or "coupled" ( Not distinguished by the modifier "integrally"), the term indicates two separate structures joined, for example, by adhesi...

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Abstract

Multicrystalline silicon (mc-Si) solar cells having patterned light trapping structures (e.g., pyramid or trough features) are generated by printing a liquid mask material from an array of closely-spaced parallel elongated conduits such that portions of the mc-Si wafer are exposed through openings defined between the printed mask features. Closely spaced mask pattern features are achieved using an array of conduits (e.g., micro-springs or straight polyimide cantilevers), where each conduit includes a slit-type, tube-type or ridge / valley-type liquid guiding channel that extends between a fixed base end and a tip end of the conduit such that mask material supplied from a reservoir is precisely ejected from the tip onto the mc-Si wafer. The exposed planar surface portions are then etched to form the desired patterned light trapping structures (e.g., trough structures).

Description

technical field [0001] The present invention relates to solar cells, and in particular to methods for producing light-trapping structures on polycrystalline solar cell wafers. Background technique [0002] Texturing of solar cells is an important process step to improve light-trapping performance and increase overall efficiency. Currently, single crystal wafers are textured using a KOH etchant that forms pyramidal structures. These structures formed along the crystal planes lead to very good light-trapping properties. [0003] On the other hand, polysilicon (mc-Si) wafers must be etched isotropically. For multicrystalline wafers, an industry standard isotexture process is used which involves etching the entire wafer surface with a suitable etchant, typically a HF / nitric acid / acetic acid mixture. The isotexturing process uses the irregularities of the kerf damage to roughen the surface. Although the isotexturing process is cost-effective, the resulting isotextured surface...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0236H01L31/18
CPCH01L31/1804H01L21/308H01L31/18H01L31/02363Y02E10/52Y02E10/547Y02P70/50
Inventor S·J·H·利姆D·德布勒克S·加纳
Owner PALO ALTO RES CENT INC