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Hot melt adhesive

A technology of hot-melt adhesives and ethylene, which is applied in the field of hot-melt adhesives, can solve the problem of narrowing of the adhesive area that can be coated, and achieve excellent adhesion and excellent adhesion

Inactive Publication Date: 2015-03-18
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when a large amount of adhesive is applied, the adhesive may sometimes protrude during processing (i.e., the area where the adhesive can be applied narrows)

Method used

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Examples

Experimental program
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Embodiment

[0119] Hereinafter, the present invention will be described by way of Examples and Comparative Examples, but the present invention is not limited to these Examples.

[0120] The components of the hot melt adhesive are shown below.

[0121] (A) Copolymer of ethylene / olefin having 3-20 carbons

[0122] (A1) Copolymer of ethylene / octene (weight-average molecular weight: 43,000, content of 1-octene: 35-37% by weight, melt flow rate: 500, manufactured by Dow Chemical Company under the trade name AFFINITY GA1950)

[0123] (A2) Copolymer of ethylene / octene (weight-average molecular weight: 38,000, content of 1-octene: 35-37% by weight, melt flow rate: 1,000, manufactured by Dow Chemical Company under the trade name AFFINITY GA1900)

[0124] (A3) Copolymer of propylene / ethylene / 1-butene (weight-average molecular weight: 34,000, glass transition point: -28°C, softening point: 124°C, melt viscosity at 190°C: 2,700 mPa·s, obtained by EVONIK DEGUSSA manufactured under the trade name VES...

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Abstract

Disclosed is a hot melt adhesive comprising: (A) a copolymer of ethylene / olefin having 3-20 carbons; and (B) a polyester polyol. The hot melt adhesive can be applied at low temperature and has a suitably long open time. Particularly, the hot melt adhesive is excellent in adhesion to a paper and is useful as a hot melt adhesive for papers.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under Article 4 of the Paris Convention based on Japanese Patent Application No. 2012-144972 filed in Japan on June 28, 2012, the entire contents of which are incorporated herein by reference. technical field [0003] This invention relates to hot melt adhesives. Furthermore, the invention relates to paper products obtainable using said hot melt adhesive. Background technique [0004] Hot-melt adhesives are solvent-free adhesives and are characterized by instant bonding and high-speed bonding because the adhesive properties of the adhesive occur when the adhesive is heated, melted, applied to the matter and then manifest itself after solidification by cooling. For example, hot melt adhesives are currently widely used in the fields of paper processing, woodworking, hygiene materials and electronics. [0005] Depending on the intended use, the following are generally used as base poly...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/06C09J123/08
CPCC09J5/06C09J167/02C09J123/20C09J123/08C09J123/0815C08L67/02C08L91/06
Inventor 高森爱
Owner HENKEL KGAA