Novel wafer-level mems chip packaging structure and packaging method

Abstract

The invention discloses a novel wafer-level MEMS chip packaging structure and a packaging method thereof. The packaging structure includes a MEMS chip and a covering silicon plate. The front of the MEMS chip and the front of the covering silicon plate use a sealing ring and several A metal bump bonding connection for electrically connecting the PIN pin of the MEMS chip; a wiring circuit is arranged on the back side of the covering silicon board, and a conductive through hole corresponding to the metal bump is arranged on the periphery of the covering silicon board, and the conductive through hole is located at Between the sealing ring and the metal bump, the conductive via hole electrically connects the metal bump and the wiring circuit. The packaging structure of the present invention cleverly transplants the packaging process to the covering silicon board, avoiding the processing on the back of the MEMS chip, so that the operable space is larger, and the more complex MEMS chip can be stably electrically conducted and conveniently Quick and easy packaging.

Description

technical field [0001] The invention relates to the field of wafer-level packaging of semiconductor MEMS chips, in particular to a novel wafer-level MEMS chip packaging structure and a packaging method thereof with a silicon cover plate having conductive through holes, indentations and rewiring circuits. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) chip packaging is a new packaging field, and its chips are mainly used in sensors. At present, in the packaging process of MEMS chips, the common structure is to use glass or silicon as the cover plate, and carry out the packaging process on the back of the MEMS chip, such as grinding, drilling, making circuits, and planting balls. However, because the MEMS chip contains a cavity inside, for The height of the MEMS chip after grinding has a certain limit, so in the subsequent packaging process, the operable space on the back of the MEMS chip is limited, so that such a packaging structure is limited to chips...

AI Technical Summary

Problems solved by technology

At present, in the packaging process of MEMS chips, the common structure is to use glass or silicon as the cover plate, and perform packaging processes such as grinding, drilling, circuit making, and ball planting on the back of the MEMS chip. However, because the MEMS chip contains a cavity inside, for The height of the MEMS chip after grinding has a certain limit, so that in the subsequent packaging process, the operable space on the back of the MEMS chip is limited, so that such a packaging structure is limited to chips with fewer lines and simple functions.

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