Heat insulating PC board and preparation method thereof
A thermal insulation and plate technology, applied in chemical instruments and methods, lamination, layered products, etc., can solve the problems of unfavorable heat preservation and high light transmittance of plates, and achieve low product cost, high light transmittance, and low ratio Effect
Active Publication Date: 2015-03-25
宁波中坚塑胶有限公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0004] Due to the above-mentioned shortcomings of the prior art, the present invention proposes a thermal insulation PC board and its preparation method, which can effectively solve the disadvantages of the prior art that the light transmittance of the board is too high and is not conducive to heat preservation
Method used
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Embodiment 1
[0031] A heat-preserving and heat-insulating PC board contains an infrared absorbing agent, and the mass percentage of the infrared absorbing agent is 0.05%, and the infrared absorbing agent is gold.
Embodiment 2
[0033] A heat-preserving and heat-insulating PC board contains an infrared absorbing agent, and the mass percentage of the infrared absorbing agent is 5%, and the infrared absorbing agent is indium tin oxide.
Embodiment 3
[0035] A heat-preserving and heat-insulating PC board contains an infrared absorbing agent, and the mass percentage of the infrared absorbing agent is 0.05%. The infrared absorbing agent is a mixture of gold and indium tin oxide in any ratio.
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Abstract
The invention discloses a heat-insulating PC board. The heat-insulating PC board contains 0.05-5 percent by mass of an infrared absorbent, wherein the infrared absorbent is one or a composition of gold and indium tin oxide. A preparation method of the heat-insulating PC board comprises the following steps: blending the infrared absorbent into PC resin by using a double-screw extruder so as to obtain PC masterbatch; uniformly pre-mixing the PC masterbatch and a PC resin matrix by using a color mixing machine or high-speed mixer; extruding and moulding a mixture by using a PC board extruder. The heat-insulating PC board prepared by the preparation method is low in proportion of an infrared additive, simple in preparation method, good in heat-insulating effect, high in light transmittance, and relatively low in product cost.
Description
technical field [0001] The invention relates to a PC board, more precisely a thermal insulation PC board. Background technique [0002] Due to the continuous rise of ambient temperature and the problem of energy loss, heat insulation and energy saving have become a social issue of concern. The development of heat insulation panels and their high potential market prospects have become a matter of great concern to people. Plates are widely used and can be used in ships, vehicles, construction plants and houses, etc. For the current environment of energy shortage, its economic benefits are also more significant. [0003] In hot summer or cold winter, the outdoor temperature is unbearable for ordinary people. Therefore, in summer, it is often necessary to turn on the air conditioner indoors to reduce the temperature to a comfortable level for the human body. In winter in the north, collective heating equipment is needed to heat the house. In this case, a poorly insulated room f...
Claims
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IPC IPC(8): C08L69/00C08K3/22B32B3/22B32B27/06B32B27/18
CPCB32B3/12B32B27/20B32B27/365B32B37/153B32B2250/05B32B2307/30B32B2307/412C08J3/226C08J2369/00C08J2469/00C08L69/00C08L2205/025C08K2003/0831C08K2003/2231
Inventor 竺立康
Owner 宁波中坚塑胶有限公司