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Panel treating method

A processing method, panel technology, applied in the fields of electrical digital data processing, chemical instruments and methods, input/output process of data processing, etc.

Inactive Publication Date: 2015-03-25
INTERFACE OPTOELECTRONICS SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a panel processing method, aiming to solve the technical problem of how to realize further thinning of touch panel components

Method used

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Embodiment Construction

[0022] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] see Figure 1 to Figure 4 , which is a schematic diagram of a panel processing method according to an embodiment of the present invention.

[0024] First, if figure 1 As shown, a substrate 10 is provided, such as a sensing substrate of a touch panel assembly, on which a plurality of component units (chips) 11 can be arranged in arrays (in this example, arranged in a 5x5 array), and the relationship between the component units 11 is They are separated by a cutting line 102 .

[0025] According to an embodiment of the present invention, the substrate 10 may include a transparent substrate and at least one sensing electrode layer (not shown), but is not limited thereto.

[0026] The above transparent substrate may include a polyethylene terephthalate (PET for short) substrate or a glass substrate, but is not li...

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Abstract

The invention discloses a panel treating method. The method comprises the steps that firstly, a substrate is provided, wherein a plurality of assembly units are arranged on the substrate; afterwards, a shielding layer is arranged on the substrate in an overlapping mode, wherein the shielding layer is provided with a plurality of openings so that active zones of the assembly units can be exposed respectively; next, a spraying process is performed, so that an adhesive film is formed in a visible range; finally, the shielding layer is removed. According to the panel treating method, gluing quality is improved, the problem that an optical adhesive film used in a traditional gluing method is too thick is solved, and therefore the touch control panel assembly can be further thinned.

Description

technical field [0001] The present invention relates to the field of touch technology, in particular to a panel processing method. Background technique [0002] Among various types of consumer electronic products today, portable electronic products such as tablet computers, personal digital assistants (PDAs), mobile phones (mobile phones), satellite navigation systems, and audio-visual players have widely used touch The touch panel component is used as a communication interface for human-machine data. [0003] A traditional touch panel assembly includes a sensing substrate and a protective cover. The sensing substrate and the protective cover are bonded together through an optical adhesive film. However, the thickness of the optical adhesive film used in the traditional lamination method is too thick, usually up to 25 microns, which makes it difficult to further thin the component. [0004] Therefore, there is still a need in this technical field for an improved panel (or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041B32B37/12
CPCG06F3/041G06F2203/04103C09J163/00C09J133/12
Inventor 卢宏杰黄彦衡陈宗凯黄世杰郑立婷曾钧麟曾贺捷陈秋棋黄昌桂庄伟仲
Owner INTERFACE OPTOELECTRONICS SHENZHEN