Unlock instant, AI-driven research and patent intelligence for your innovation.

Preparation method of flexible substrate and flexible substrate prefabricated assembly

A technology of flexible substrates and prefabricated components, applied in the direction of electrical components, electrical solid devices, semiconductor devices, etc., can solve the problems of high production cost, low production efficiency, residue on the back of the flexible layer, etc., to reduce production costs and facilitate precision counterpoint effect

Inactive Publication Date: 2017-12-12
BOE TECH GRP CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method requires scanning of high-energy laser beams, and the production efficiency is low, the production cost is high, and the uniformity of the peeling is poor, which easily leads to residues on the back of the flexible layer.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of flexible substrate and flexible substrate prefabricated assembly
  • Preparation method of flexible substrate and flexible substrate prefabricated assembly
  • Preparation method of flexible substrate and flexible substrate prefabricated assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] like figure 1 As shown, it is a schematic structural diagram of a flexible substrate prefabricated assembly according to an embodiment of the present invention. When preparing the flexible substrate, a single-sided adhesive layer 2 can be arranged in the middle part of the supporting substrate 1, so that the adhesive surface of the single-sided adhesive layer 2 is in contact with the supporting substrate 1; It is to arrange the double-sided adhesive layer 3 in all or part of the area around the support substrate 1. Preferably, the thickness of the double-sided adhesive layer 3 is the same as the thickness of the single-sided adhesive layer 2; The flexible layer 4 is arranged on the surface of the flexible layer; the electronic device 5 is arranged on the surface of the flexible layer, and the electronic device 5 is located in the area of ​​the single-sided adhesive layer 2, that is, the area of ​​the electronic device 5 is less than or equal to the area of ​​the single-...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for preparing a flexible substrate and a prefabricated assembly of the flexible substrate. The flexible substrate includes an electronic device and a flexible layer provided with the electronic device. A double-sided adhesive layer is arranged around the supporting substrate; a flexible layer is arranged on the surface of the single-sided adhesive layer and the double-sided adhesive layer, and an electronic device is arranged on the surface of the flexible layer corresponding to the single-sided adhesive layer, and the flexible layer is cut off along the boundary of the electronic device In order to obtain a flexible substrate that can be removed from the single-sided adhesive layer. By adopting the method and flexible substrate prefabricated assembly provided by the invention, the flexible layer can be fixed and its flatness can be maintained, which is beneficial to the precise alignment of electronic devices; the flexible layer can be evenly peeled off, and the back side of the peeled flexible layer will not There is no residue, and there is no need to use high-energy laser beams during peeling, which can effectively reduce production costs.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a preparation method of a flexible substrate and a prefabricated assembly of the flexible substrate. Background technique [0002] At present, there are two main methods for preparing flexible substrates. One preparation method is to use a roll-to-roll method to directly arrange electronic devices on the flexible layer by printing to obtain a flexible substrate. However, due to the immaturity of the existing printing technology, only some products with low precision requirements can be prepared. , the yield is low and the product quality is poor. The second preparation method is the sticking and removing method, which is widely used at present. The flexible layer is pasted on the hard substrate through the adhesive layer, and after the electronic device is set on the flexible layer, the high-energy laser beam is used for the hard substrate. The back side is scanned, th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/00H01L21/02H05K3/00H05K1/02
CPCH01L2924/0002H05K1/0393H05K3/022H05K2203/0235H05K2203/068H01L21/4846H01L21/6835H01L2221/68318H01L2221/6835H01L2221/68381H01L27/1218H10K71/80H10K2102/311H10K59/80522H01L2924/00H10K50/824H01L23/00H05K1/028H05K3/4644H05K2201/0195
Inventor 王美丽孙宏达刘凤娟
Owner BOE TECH GRP CO LTD