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A kind of laser sintering equipment and sintering method

A laser sintering and equipment technology, which is applied in the direction of electrical components, circuits, and energy efficiency improvement, can solve the problems of glass glue cracks and damages, and achieve the effects of reducing temperature difference, reducing stress, and avoiding cracks or even damage

Active Publication Date: 2017-05-31
BOE TECH GRP CO LTD +1
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Problems solved by technology

[0004] The purpose of the technical solution of the present invention is to provide a laser sintering equipment and a sintering method, which is used to solve the problem that the glass glue forms cracks or breaks due to the large shrinkage stress generated by laser sintering when laser packaging is used in the prior art display manufacturing process

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  • A kind of laser sintering equipment and sintering method
  • A kind of laser sintering equipment and sintering method
  • A kind of laser sintering equipment and sintering method

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Embodiment Construction

[0044] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0045] According to the laser sintering equipment according to the specific embodiment of the present invention, the laser sintering equipment includes:

[0046] a first laser head for outputting a laser of a first power;

[0047] a second laser head for outputting laser light of a second power;

[0048] A driving device is used for driving the first laser head and the second laser head to move, so that the first laser head and the second laser head respectively heat the same area on the material to be sintered.

[0049] The laser sintering equipment according to the embodiment of the present invention adds a laser head on the basis of the laser head used in the existing laser packaging, and uses two laser heads to heat the material to be sint...

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Abstract

The invention provides a laser sintering device and a sintering method. The laser sintering equipment includes: a first laser head, used to output a laser with a first power; a second laser head, used to output a laser with a second power; a driving device, used to drive the first laser head and the second laser head to move , so that the first laser head and the second laser head respectively heat the same area on the material to be sintered. The present invention utilizes two laser heads to heat the material to be sintered arranged on the device to be sintered, so that the two laser heads respectively heat a certain region of the material to be sintered to be heated respectively, so that the material to be sintered before laser sintering Preheating, or annealing the material to be sintered after laser sintering, so as to reduce the temperature difference before laser sintering compared with laser sintering or reduce the temperature drop rate after laser sintering, so as to reduce the stress of the substrate of the material to be sintered , to avoid cracks or even breakage caused by shrinkage stress.

Description

technical field [0001] The invention relates to the technical field of display manufacturing, in particular to a laser sintering device and a sintering method. Background technique [0002] An organic light-emitting diode (Organic Light-Emitting Diode, OLED) display device is a display device in which a light-emitting material is driven by a current to emit light autonomously. Since the light-emitting materials in OLED displays are very sensitive to temperature, air, and water, good encapsulation is critical to the lifespan and picture quality of OLED displays. There are various packaging technologies for OLED displays, such as laser packaging, thin film packaging, and injection packaging. Among them, the laser encapsulation technology is a relatively mature OLED encapsulation technology. Its main working principle is to use the precise and rapid heating and melting of the laser to sandwich two glass substrates (one for the cover glass, one for the luminescent material and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56
CPCB22F12/45B22F12/226H10K50/8426H10K50/84H10K71/00Y02P10/25B29C2035/0838C03C27/06B29C35/0805
Inventor 肖昂
Owner BOE TECH GRP CO LTD
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