3results about How to "Avoid cracks or even breakage" patented technology

This application discloses an adjustable frame assembly, belonging to the technical field of frame assembly. It includes four symmetrically arranged channel steel legs, each with a support column at its bottom; and a mounting frame fixedly disposed between the two channel steel legs, with two channel steel legs symmetrically arranged on each side of the mounting frame. This application utilizes a sliding support column on the inner side of the channel steel legs and adjusts the support height of the support column by incorporating an adjustment component inside the channel steel legs. This results in higher strength for the support column and adjustment component under the horizontal limiting action of the channel steel legs, requiring only the adjustment component to vertically press the support column. Therefore, it effectively solves the problem that traditional welding or bolted connections may cause cracks or even breakage during the operation of large, heavy equipment, affecting the stability of safe operation. This achieves vertical support at the bottom of the frame to prevent cracks or breakage at the stressed connection.

This application provides a method for cutting a semiconductor device. The semiconductor device includes a ceramic substrate and an electronic chip. An epoxy resin layer encapsulates the electronic chip on the ceramic substrate. In the vertical direction, the projected area of ​​the epoxy resin layer is smaller than the projected area of ​​the ceramic substrate, and there is a distance between the epoxy resin layer and the edge of the ceramic substrate. The cutting method includes the following steps: coating an anti-adhesion layer on the edge of the ceramic substrate, the anti-adhesion layer and the epoxy resin layer being located on the same side of the ceramic substrate and horizontally away from the epoxy resin layer; covering the epoxy resin layer and the anti-adhesion layer with an adhesive ultraviolet film, in the vertical direction, the projected area of ​​the adhesive ultraviolet film being greater than or equal to the projected area of ​​the ceramic substrate; treating the anti-adhesion layer to reduce its adhesiveness; fixing the adhesive ultraviolet film to a base and cutting the ceramic substrate. The above method can avoid the large deformation and stress caused by the stretching of the ceramic substrate edge due to the height difference between different materials, thus preventing cracks or fractures.

This invention relates to the field of twin-roll thin strip casting and rolling technology, specifically disclosing a composite side sealing plate applied to the twin-roll thin strip casting and rolling process. The thermal conductivity, elastic modulus, and coefficient of linear expansion of the composite side sealing plate vary gradients along the thickness direction; or the thermal conductivity, elastic modulus, and coefficient of linear expansion of the composite side sealing plate vary gradients along the height direction. Therefore, when this composite side sealing plate is applied to the twin-roll thin strip casting and rolling process, it can effectively reduce the maximum thermal stress generated by the composite side sealing plate, avoid cracks or even fractures caused by the interaction between thermal stress and supporting force, and improve the service life of the composite side sealing plate.