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A kind of exposure system and method of multi-dmd splicing

An exposure system and interface technology, which is applied in the field of large-size, large-area DMD exposure systems, can solve problems affecting exposure accuracy, etc., and achieve the effect of overcoming low exposure efficiency, high efficiency, and increasing area

Active Publication Date: 2016-06-22
XIAMEN UNIV OF TECH
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The frequent start and stop of the two-dimensional mechanical mechanism in the stepping exposure method will produce mechanical vibration, which will affect the exposure accuracy

Method used

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  • A kind of exposure system and method of multi-dmd splicing
  • A kind of exposure system and method of multi-dmd splicing
  • A kind of exposure system and method of multi-dmd splicing

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Embodiment Construction

[0022] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0023] As a specific example, such as Figure 1 to Figure 3 As shown, a kind of multi-DMD splicing exposure system of the present invention comprises main frame, core control board, a plurality of DMD driver boards and DMD chip, and described main frame is connected with core control board by USB cable, and core control board and DMD The driver boards are connected through a parallel bus, and the DMD chip is connected to the DMD driver board.

[0024] The host is used to divide the binary image into multiple sub-images, number each sub-image, and send the sub-images to the core control board through the USB cable in sequence,

[0025] The core control board is used to receive the sub-image, and synchronously send the sub-image to multiple DMD driver boards through the parallel bus according to the serial number, and each DMD driver board receives a ...

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Abstract

The invention relates to the field of imaging and exposure of DMDs (Digital Mirror Devices) and provides an exposure system spliced by a plurality of DMDs and a method. The system comprises a host, a core control board, a plurality of DMD driver boards and a DMD chip, wherein the host is connected with the core control board through a USB (Universal Serial Bus) cable; the core control board is connected with the DMD driver boards through a parallel bus; the DMD chip is connected with the DMD driver boards. The exposure system and the method has the advantages that through arranging one core control board, an image is segmented, and the plurality of DMD driver boards are connected through a high-speed parallel interface to drive the plurality of DMDs to realize synchronous turning; segmented sub images are subjected to synchronous turning exposure, and further, the exposure of a binary image with large size is satisfied; according to the method, through segmenting the image and performing the synchronous turning exposure on the segmented sub images, the exposure of the binary image with large size is further satisfied; through the method, the exposure time and the synchronous exposure of the nine DMDs can be accurately controlled, so that the consistence of micromirror pixel exposure time and the exposure accuracy are ensured.

Description

technical field [0001] The invention relates to the field of DMD (Digital Mirror Device, digital micromirror device) device imaging exposure, specifically a method for multi-DMD parallel splicing to improve exposure efficiency, and especially relates to a large-size, large-area DMD exposure system and method. Background technique [0002] In 3D (3-Dimension, 3-dimensional) printing, CTS (computer-to-screen) and other systems, it is currently more popular to use DMD as the key output device for imaging exposure. Due to the small size of exposure achieved by a single DMD, if large-scale exposure is to be achieved, it is generally necessary to use a stepping exposure method through a two-dimensional mobile platform. The frequent start and stop of the two-dimensional mechanical mechanism in the step exposure method will generate mechanical vibration, which will affect the exposure accuracy. Contents of the invention [0003] To solve the above-mentioned technical problems, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 黄新栋王旭
Owner XIAMEN UNIV OF TECH
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