Unlock instant, AI-driven research and patent intelligence for your innovation.

Epoxy resin adhesive and flexible copper clad laminate prepared by the adhesive and preparation method

A technology of flexible copper clad laminate and epoxy resin, applied in the direction of online phenolic epoxy resin adhesive, adhesive type, aldehyde/ketone condensation polymer adhesive, etc., can solve the problem of poor heat resistance and difficulty in ensuring metallization Hole thermal shock resistance, limited use range, etc.

Inactive Publication Date: 2017-05-31
HONGYANG ELECTRONICS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production formula and process of adhesives are divided into two series in the world: the first category: acrylic resin (acrylicresin), which is a thermoplastic resin with low Tg point, poor heat resistance, high fluidity, and no chemical resistance. , the expansion coefficient is large, and it is difficult to guarantee the thermal shock resistance of the metallized hole. With the rapid development of communication information and microelectronics industry, the products are changing in the direction of light, thin, short, small and high performance. The use of flexible circuits Substrate requirements are getting higher and higher, unable to meet the requirements of medium and high-end products, and can only be limited to low-end products, which greatly limits its scope of use
The second category: epoxy resin (epoxy resin), which is a thermosetting resin with excellent performance, high peel strength and heat resistance, good dielectric and folding resistance and excellent size Stability and chemical resistance, small expansion coefficient, etc., these good properties can meet the stringent requirements of today's ever-changing electronic products, with the introduction of EU RoHS high-environmental protection, promote the development of green products, and implement lead-free high-temperature soldering The manufacturing process and product technical content have been greatly improved, but there are still great technical barriers, such as solving the halogen problem, improving Tg point, achieving excellent insulation and chemical resistance, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin adhesive and flexible copper clad laminate prepared by the adhesive and preparation method
  • Epoxy resin adhesive and flexible copper clad laminate prepared by the adhesive and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] formula parts by mass Multifunctional epoxy resin 100 Nitrogen-containing phenolic resin curing agent 100 High dielectric constant filler 40 A silane coupling agent 1 Defoamer 1

[0014] According to the preparation process of the present invention and the above ratio, after mixing 100 parts of multifunctional epoxy resin with 40 parts of high dielectric constant filler, 1 part of silane coupling agent and 1 part of defoamer at 80 ° C, add 100 parts of nitrogen phenolic resin curing agent, co-heated to make a uniform liquid, degassed, poured into a mold, kept at 120 ° C for 2 hours, raised to 150 ° C and kept for 4 hours, and then released from the mold to cool, and the resin sample was obtained; Get FCCL samples.

Embodiment 2

[0016] formula parts by mass Multifunctional epoxy resin 100 Nitrogen-containing phenolic resin curing agent 80 High dielectric constant filler 40 A silane coupling agent 1 Defoamer 0.7

[0017] In parts by weight, after mixing 100 parts of the prepared multifunctional epoxy resin with 40 parts of high dielectric constant filler, 1 part of silane coupling agent and 0.7 part of defoamer at 60 ° C, add nitrogen-containing phenolic resin 80 parts of curing agent were heated together to make a uniform liquid, degassed, poured into a mold, kept at 110°C for 2 hours, raised to 160°C and kept for 4 hours, and then released from the mold to cool to obtain a resin sample; and FCCL samples were obtained .

Embodiment 3

[0019] formula parts by mass Multifunctional epoxy resin 100 Nitrogen-containing phenolic resin curing agent 70 High dielectric constant filler 40 A silane coupling agent 0.8 Defoamer 1

[0020] In parts by weight, mix 100 parts of the prepared multifunctional epoxy resin with 40 parts of high dielectric constant fillers, 0.8 parts of silane coupling agent, and 1 part of defoamer at 70 ° C, and then add nitrogen-containing phenolic resin 70 parts of curing agent were heated together to make a uniform liquid, degassed, poured into a mold, kept at 115°C for 2 hours, raised to 150°C and kept for 4 hours, then released from the mold and cooled to obtain a resin sample; and FCCL samples were obtained .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an epoxy resin adhesive which consists of the following components in parts by weight: 100 parts of epoxy resin, 70-100 parts of a nitrogen-containing phenolic resin curing agent, 30-60 parts of high dielectric constant filler, 1-2 parts of a silane coupling agent and 1-2 parts of a defoaming agent. The flexible copper-clad plate prepared from the epoxy resin adhesive disclosed by the invention is high in Tg (more than or equal to 120 DEG C) and capable of meeting the requirement of high-temperature resistant dip soldering (more than or equal to 320 DEG C); and the requirements of the flexible copper-clad plate are satisfied.

Description

technical field [0001] The invention relates to the technical field of adhesives, and more specifically relates to an epoxy resin adhesive, a flexible copper-clad laminate prepared by the adhesive, and a preparation method. Background technique [0002] Flexible Copper Clad Laminate (FCCL) is the basic material for the production of printed circuit boards, usually made of polyimide (PI) film, adhesive and copper foil thermally laminated. Among them, the adhesive used to bond PI film and copper foil is one of the main factors that determine the performance of copper clad laminates. Generally, there are two types of acrylate and epoxy resin. In recent years, the printed circuit board industry has continuously increased the requirements for the high temperature resistance of flexible copper clad laminates, especially new processes such as lead-free soldering require FCCL boards to withstand higher tin soldering bath temperatures (when soldering with lead, solder resistance of F...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/04C09J161/14C08G59/08B32B7/12B32B15/08B32B37/12B32B37/06B32B37/10
Inventor 陈敬强魏巍邓鹏飏柳美华金红梅
Owner HONGYANG ELECTRONICS