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A 3D stacked structure of an ltcc substrate

A stacked structure and substrate technology, applied in the field of microelectronics, can solve the problems of low mechanical strength, high welding difficulty, low assembly area ratio, etc., and achieve the effect of increasing mechanical strength, improving assembly efficiency, and alleviating assembly difficulty

Active Publication Date: 2017-06-09
NO 771 INST OF NO 9 RES INST CHINA AEROSPACE SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problems existing in the existing substrate stacking technology are: 1. The proportion of the available assembly area is very low; 2. It is difficult to realize the airtightness of a single component; 3. The welding between components is very difficult; 4. The entire component The mechanical strength is very low and cannot meet the needs of use

Method used

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  • A 3D stacked structure of an ltcc substrate
  • A 3D stacked structure of an ltcc substrate
  • A 3D stacked structure of an ltcc substrate

Examples

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Embodiment Construction

[0024] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0025] Such as figure 1 , 2 As shown, the present invention provides a 3D stacked structure of LTCC substrates, including: several stacked LTCC substrate structures, the LTCC substrate structures are connected by I / O interconnection and mechanical connection; several stacked LTCC substrate structures A housing 3 for encapsulation is provided on the outside; wherein, the LTCC substrate structure includes a lower substrate 1 and an upper substrate 2, the upper substrate 2 is fastened on the lower substrate 1, a cavity is formed between the lower substrate 1 and the upper substrate 2, and the lower substrate 1 Both the upper substrate 2 and the upper substrate 2 can be arranged with components. Specifically, the edge of the lower substrate 1 is sequentially provided with a first step 11 for mechanically fixing the upper substrate 2 and the lower substrate 1 and a seco...

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Abstract

The present invention provides a 3D stacked structure of LTCC substrates, including: a two-layer stacked LTCC substrate structure and a stacking method, I / O interconnection and mechanical connection between LTCC stacked substrates; wherein, the LTCC substrate stacking structure It includes a lower substrate and an upper substrate, the upper substrate is buckled on the lower substrate, a cavity is formed between the lower substrate and the upper substrate, and components can be arranged on the lower substrate and the upper substrate. The substrates are mechanically connected by bonding, and the LTCC substrate structures are electrically connected by bonding, so that the mechanical connection and electrical connection are carried out in separate areas, which effectively improves the assembly efficiency of the laminate and reduces the difficulty of assembly. , improving the reliability of the LTCC substrate stack assembly.

Description

technical field [0001] The invention belongs to the technical field of microelectronics and relates to the structural design of an LTCC substrate module, in particular to a 3D laminated structure of an LTCC substrate. Background technique [0002] The existing LTCC (Low Temperature Co-fired Ceramic, low temperature co-fired ceramics) substrate stacking technology, by making a cavity on a single substrate, placing components in the cavity of a single substrate, and then using a metal cover plate to complete the cavity The hermetic packaging of the body forms a functional unit, that is, a component. Several components with different functions are connected by BGA soldering through solder balls. The connection serves as both a mechanical connection between components and an electrical connection between components. connect. The entire assembly is electrically interconnected with the outside world, and is connected in the form of BGA or PGA through the bottommost assembly. [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/495
Inventor 石伟李建国任英哲肖刚
Owner NO 771 INST OF NO 9 RES INST CHINA AEROSPACE SCI & TECH
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