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A kind of manufacturing method of resin plug hole in pcb

A manufacturing method and technology of resin plugging holes, which are applied in the fields of printed circuit manufacturing, processing step sequence, electrical components, etc., can solve the problems affecting the manufacturing accuracy of subsequent processes, board expansion and contraction, and shortening the process flow, so as to ensure the manufacturing accuracy and simplify the process. Production process, the effect of shortening the production process

Active Publication Date: 2018-02-02
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention aims at the problem that the production process of the existing PCB resin plug holes requires abrasive belt grinding to cause expansion and contraction of the board, thereby affecting the production accuracy of the subsequent process, and provides a method that can reduce the instability of expansion and contraction caused by abrasive belt grinding , and can shorten the manufacturing method of the resin plug hole in the PCB

Method used

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  • A kind of manufacturing method of resin plug hole in pcb
  • A kind of manufacturing method of resin plug hole in pcb
  • A kind of manufacturing method of resin plug hole in pcb

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Experimental program
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Embodiment

[0019] This embodiment provides a method for manufacturing a resin plug hole in a PCB. The parameters of the PCB manufactured by this method are as follows:

[0020]

[0021] The specific production steps are as follows:

[0022] (1) First cut the base material, the thickness of the core board is 1.2mm H / H, and then use the drilling data to drill holes that need to be made into metallized buried holes on the core board. Then, the core board is sequentially subjected to copper sinking treatment (backlight test level 10) and full board electroplating treatment (full board electroplating at a current density of 18ASF for 60 minutes, and the thickness of the hole copper is Min 20 μm), so that the drilled holes are metallized to form metallization buried hole.

[0023] (2) Use the negative film process (or positive film process) to make the inner layer circuit on the core board. When making the inner layer circuit, use a fully automatic exposure machine to complete the inner la...

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Abstract

The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing a resin plug hole in a PCB. In the present invention, by adjusting the process flow, resin is filled in the metallized buried holes after the inner layer circuit is made on the inner layer board. The resin on the surface of the inner layer board is removed, so that the step of grinding the board with the abrasive belt can be omitted, and the expansion and contraction of the inner layer board due to the grinding of the abrasive belt can be avoided, which affects the manufacturing accuracy of the subsequent process. By adjusting the manufacturing process, the present invention not only ensures the manufacturing accuracy of the PCB, but also shortens the manufacturing process, simplifies the production process, and reduces the production cost.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing a resin plug hole in a PCB. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, referred to as printed board, is one of the important components of the electronics industry, is the support of electronic components, and the carrier of electrical connections. In PCB, it is usually necessary to design buried holes, and in PCB production, it is necessary to fill the buried holes with resin for subsequent pressing and other processes. The production process of the existing technology is usually: material cutting→inner layer core board drilling→inner layer copper sinking→inner layer full board electroplating→resin plug hole and baking board curing→abrasive belt grinding board→inner layer circuit→inner layer etching →Inner layer AOI→browning→pressing→post process. In the existing production process,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0094H05K2203/14
Inventor 黄力邓峻敖四超韦昊
Owner JIANGMEN SUNTAK CIRCUIT TECH
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