Processing device

Abstract

The present invention provides a processing device capable of measuring a processing area without taking out a processed object from the processing device. The processing device is provided with a measuring member for measuring the processing area of ​​a workpiece processed by the processing member, and the measuring member is characterized in that the measuring member includes: a three-dimensional measuring member, which is perpendicular to each other in the X-axis direction, the Y-axis direction and the Three-dimensionally measure the workpiece in the Z-axis direction to obtain shape information; and a processing unit that processes the information obtained by the three-dimensional measurement unit and generates image information, the processing unit includes: an image information generation unit that stores the information based on the Z-coordinate The Z coordinate stored in the unit three-dimensionally combines the pixels of the XY coordinates stored in the XY coordinate storage unit to generate image information; and the calculation unit calculates the measurement value of the measurement object of the workpiece based on the generated image information without The processed workpiece can be taken out from the processing device to measure the processing area.

Description

technical field [0001] The present invention relates to processing devices such as laser processing devices and cutting devices. Background technique [0002] Wafers such as silicon wafers and sapphire wafers, which are divided by dividing lines and have IC (Integrated Circuit: Integrated Circuit), LSI (Large Scale Integration: Large Scale Integration) and LEDs formed on the surface, are divided by processing equipment The separated devices are widely used in various electronic devices such as mobile phones and computers. [0003] For dividing wafers, a dicing method using a cutting device called a dicing machine is widely used. In the dicing method, the cutting blade is cut into the wafer while rotating at a high speed of about 30,000 rpm to cut the wafer, and the wafer is divided into individual devices. The cutting blade is fixed with abrasive grains such as diamond by metal or resin. Instead, it is formed to have a thickness of about 30 μm. [0004] On the other hand,...

AI Technical Summary

Problems solved by technology

[0009] However, the image captured by the imaging device equipped with a microscope and a camera is a two-dimensional image, and the width or depth of the processing groove formed by cutting or laser processing, and the height or width of the chip can only be roughly measured, and it cannot be measured in the device. Detect the cross-sectional shape of the machining groove and the volume of chips

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