Spring support plate, fracture device and dividing method

Abstract

The invention relates to a spring support plate, a fracture device and a dividing method. Resin layers of a composite substrate can be fractured along a fracture line. One face of the composite substrate is provided with substrate coating resin layers which are orderly arranged longitudinally and transversely so as to form multiple functional areas, and parts of the substrate are fractured at advance. Structural bodies (14) protruding from the functional areas are arranged on the upper surface of the composite substrate (10). Grid-shaped areas which are the same as the lines of the composite substrate (10) in separation distance are distributed on the spring support plate (40). Centers of the areas comprise protection holes (41) larger than the functional areas. When the resin layers of the composite substrate (10) are fractured, the structural bodies (14) of the functional areas are aligned to the protection holes (41) so as to dispose the composite substrate on the spring support plate (40). Then, extension bars are pressed from upper parts and the lower parts. In this way, the resin layers (12) can be fractured without damage to the functional areas (13).

Description

technical field [0001] The present invention relates to an elastic support plate, a breaking device and a breaking method used in breaking a composite substrate formed by coating a resin layer on a brittle material substrate such as a semiconductor substrate or a ceramic substrate. Background technique [0002] A semiconductor chip is manufactured by dividing element regions formed on a semiconductor wafer at boundary positions of the element regions. Conventionally, when dividing a wafer into chips, a dicing device rotates a dicing blade to cut a semiconductor wafer into smaller pieces by cutting. [0003] However, in the case of using a cutting device, there must be someone to discharge the discharge debris generated by the cutting. In order not to cause the water or discharge debris to adversely affect the performance of the semiconductor chip, there must be steps before and after the semiconductor chip. protection, and rinse off water or expel debris. Therefore, there ...

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Problems solved by technology

Therefore, there is a disadvantage that the steps become complicated, and it is impossible to reduce the cost or shorten the processing time

In addition, since cutting is performed with a dicing blade, problems such as film peeling or chipping may occur

In addition, in the MEMS (Micro-Electro-Mechanical Systems, Micro-Electro-Mechanical Systems) substrate with a micro-mechanical structure, the surface tension of water will cause structural damage, so water cannot be used, resulting in the problem that it cannot be divided by dicing

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