Check patentability & draft patents in minutes with Patsnap Eureka AI!

Inter-chip data transmission method

A data transmission method and data transmission technology, applied in the field of data transmission between chips, can solve the problems of heavy weight, high power consumption of parallel interfaces, high cost, etc., and achieve the effects of improving transmission speed, improving reliability and reducing complexity.

Active Publication Date: 2015-04-29
NO 771 INST OF NO 9 RES INST CHINA AEROSPACE SCI & TECH
View PDF4 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The parallel interface also has disadvantages such as high cost and heavy weight.
The power consumption of the parallel interface is often relatively large

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Inter-chip data transmission method
  • Inter-chip data transmission method
  • Inter-chip data transmission method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0032] see figure 1 with figure 2 , the present invention a kind of data transmission method between chips, comprises the following steps:

[0033] 1) Encode the data to be transmitted to obtain data in a serial format, and generate an error correction code according to the data in a serial format, wherein the data frame in a serial format consists of a start bit of data, a logical channel, a data entity, Data error correction and protection gap;

[0034] Among them, the start bit of the data frame in the serial format is a logic "1", indicating the beginning of the data frame. In the case of parallel transmission of multi-channel data, all signals have the same start bit "1";

[0035] The logical channel bit of the data consists of 5 bits, indicating that the transmission channel used by the data supports up to 32 channel transmissions;

[0036] The dat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an inter-chip data transmission method including the steps of 1, encoding data to be transmitted to obtain data of serial format, generating an error correcting code according to the data of serial format, with frame composition of the data of serial format including data start bit, logical channel, data entity, data correcting-checking bit and protective gap; 2, subjecting the data of serial format to error correcting according to the error correcting code, to be specific, subjecting the data to correctness judging in the protective cap; 3, if the data of serial format is correctly transmitted, continuing transmission of a next frame; if the data of serial format is wrongly transmitted, returning a response to repeat the transmission of the former frame. The inter-chip data transmission method has the advantages that data transmission speed is greatly increased, interconnection lines are easier, and system reliability is largely improved.

Description

technical field [0001] The invention relates to the technical field of data transmission, in particular to a data transmission method between chips. Background technique [0002] With the continuous development of the demand for the performance, richness and perfection of functions, low cost and miniaturization of electronic products, microelectronics and integrated circuit technology are also developing continuously. At present, industrial products and consumer electronic products are developing in the direction of miniaturization and portability, and military products and spacecraft products have stronger requirements for miniaturization of electronic products. These requirements make SoC technology an inevitable trend in the development of integrated circuits. At the same time, it also promotes the rapid development of SIP (System in Package, system-in-package) technology. [0003] The core idea of ​​using SoC technology to design a system is to integrate the entire app...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F11/10G06F13/28
Inventor 张佳盛廷义唐威
Owner NO 771 INST OF NO 9 RES INST CHINA AEROSPACE SCI & TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com