Heat Sink for Chip Mounting Substrate and Method for Manufacturing Same

Abstract

Provided is a heat sink for a chip mounting substrate in which a heat dissipation material is embedded. The heat sink includes: an accommodation portion configured to accommodate a substrate whereon a chip is mounted or to be mounted, and support or fix the accommodated substrate; and a heat dissipation portion configured to insulate the accommodated substrate, and dissipate heat generated from the substrate or the chip mounted on the substrate to an outside through a heat dissipation material contained in the heat dissipation portion. Accordingly, since the heat sink for a chip mounting substrate in which a heat dissipation material is embedded is manufactured by injection molding, a manufacturing process can be simplified. Further, since the heat sink of a single structure is used, a TIM bonding layer for bonding the substrate and the heat sink is not required, and an electrical insulating layer formed by anodizing an upper surface of the heat sink for electrical insulation between the substrate and the heat sink is not required, and thus the structure can be simplified.

Description

technical field [0001] The present invention relates to a heat sink for a chip mounting substrate and a method for manufacturing the same, and more specifically, to a heat sink for a chip mounting substrate containing a heat dissipation substance. Background technique [0002] In general, LED (Light Emitting Diode), which is a semiconductor light emitting diode, is an environmentally friendly light source that does not cause pollution, and has attracted attention in various fields. Recently, as LEDs are used in various fields such as indoor and outdoor lighting, automobile headlights, and backlight units (BLU) of display devices, high efficiency and excellent heat dissipation characteristics of LEDs are required. In order to obtain a high-efficiency LED, it is necessary to improve the material or structure of the LED at one time, but in addition, the structure of the LED package and the material used for it, etc. also need to be improved. [0003] In such high-efficiency LE...

AI Technical Summary

Problems solved by technology

[0004] However, according to conventional optical devices, there is a limitation in reducing the thickness of the TIM adhesive layer for attaching the substrate to a heat sink made of aluminum or the like in order to release heat generated in an optical element such as an LED. Even if a material with good heat transfer is used, there is a problem of low heat dissipation characteristics due to its thickness. In addition, the process of correctly arranging the optical device on the heat sink is done manually, so not only the productivity is low, but also according to the operator's requirements. There is a problem that uniform heat dissipation performance cannot be ensured due to differences in the overall coating thickness or a part of the coating thickness of the TIM adhesive layer.

[0005] In addition, for electrical insulation, a process of anodizing the upper surface of the heat sink to form an electrical insulating layer is required, so there is a problem that man-hours increase.

[0006] In addition, in the separation of each unit optical device manufactured by means of the original board for optical devices, that is, burrs (burr) occur in the process of cutting (sawing) or dicing (dicing), so that the upper surface of the heat sink with an extremely thin layer However, the formed anodized insulating layer is damaged, and the insulation between the substrate and the heat sink is destroyed, so that there are problems such as short circuits.

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