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Method for insulation and moisture resistance of chips of suspended piezoelectric ceramic frequency device

A technology of frequency devices and piezoelectric ceramics, which is applied in the field of insulating and moisture-proof chips of suspended piezoelectric ceramic frequency devices, can solve problems such as insulation degradation and failure, and achieve the effects of reducing production costs and facilitating work stability

Inactive Publication Date: 2015-04-29
HUNAN JIAYEDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the commonly used insulation and moisture-proof method is to clean the ceramic chips and strictly control the process to prevent pollution, such as ensuring the dry humidity during assembly, and employees wearing masks, gloves and finger cots, etc. Moisture or pollution makes the insulation drop and fails

Method used

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  • Method for insulation and moisture resistance of chips of suspended piezoelectric ceramic frequency device
  • Method for insulation and moisture resistance of chips of suspended piezoelectric ceramic frequency device
  • Method for insulation and moisture resistance of chips of suspended piezoelectric ceramic frequency device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1: The method of implementing insulation and moisture-proof before the large ceramic chip is cut off:

[0017] figure 1 An analysis of the typical structure of a frequency device with a piezoelectric ceramic chip suspended in the air. The small ceramic chip 1 is clamped by two silver-plated reeds 2, and then stuck in the plastic shell 3. The two pins 5 outside the plastic shell 3 of the product are connected with the silver-plated reed 2. The size of the small ceramic chip is 5mm*5mm*0.65mm.

[0018] in such as figure 2 On the large ceramic chip 1 with a size of 24mm*24mm*0.65mm, one side is centered with a large silver electrode 6 with a size of 22mm*22mm, and the other side is centered with 16 electrodes with a center distance of 5.4mm and a size of 4.5mm* Small silver electrodes 601 of 4.5mm. On the side where there are 16 small silver electrodes 601, do the following image 3 The insulating moisture-proof layer 7 shown has 16 holes 8 with a center d...

Embodiment 2

[0020] Embodiment 2: The method of implementing insulation and moisture-proof after the combination of small ceramic chips:

[0021] Combining 16 small ceramic chips into a figure 2 Shown large ceramic chip, then use the same method of embodiment one to make insulating and moisture-proof layer 7, then directly separate to form such as Figure 5 Shown is the small ceramic chip 1 .

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Abstract

The invention discloses a method for insulation and moisture resistance of chips of a suspended piezoelectric ceramic frequency device. The method comprises the step of separating an upper silver electrode and a lower silver electrode of a small ceramic chip by an insulating and moisture-resisting material before the assembling of the device to ensure that an insulating isolation belt exists between the two silver electrodes. The insulating and moisture-resisting material is resin or printing ink or oil paint; the forming of the isolation belt is carried before the cutting of a big ceramic chip or after the assembling of the small ceramic chip. The forming manner of the isolation belt is printing, spraying or transfer printing. The method has the following benefits: 1, the insulating isolation belt which is made by the insulating and moisture-resisting material is arranged between the two electrodes of the ceramic chip, and one end of the isolation belt straddles the electrodes and the other end straddles the ceramic, so that the possibility that the ceramic adsorb pollutant is cut off and the working stability of the piezoelectric ceramic chip is facilitated; 2, the forming of the isolation belt is carried before the cutting of a big ceramic chip or after the assembling of the small ceramic chip, so that the large-scale industrial production is facilitated, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of piezoelectric ceramics, in particular to a method for insulating and moisture-proofing chips of suspended piezoelectric ceramic frequency devices. Background technique [0002] As an electronic original device, its insulation resistance must meet certain requirements, otherwise the whole machine will not work normally. The typical structure of the piezoceramic vibration frequency device is to place the chip in the cavity of the shell and fix it by clamping the spring piece. The insulation resistance of this device is determined by the chip, and the chip is made of ceramic and metal on both sides of the ceramic. Composed of silver electrodes, the ceramics are porous and easy to absorb water. The thickness of the chip is generally only between 0.3-1.0mm. If the ceramics between the two silver electrodes are polluted by hand sweat or saliva containing metal ions, when drying The insulation resistance is qua...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H9/02
Inventor 刘志潜刘宗玉施小罗
Owner HUNAN JIAYEDA ELECTRONICS