High-melting-point alloy thixoforming device and forming process

Abstract

The invention discloses a high-melting-point alloy thixoforming device and a forming process. The thixoforming device comprises a temperature measuring component, a forming component and a vacuum chamber, wherein the temperature measuring component comprises an R-type thermocouple and an external instrument; the R-type thermocouple is connected with the external instrument; the forming component comprises two forming units which are symmetrically arranged; the forming component is arranged in the vacuum chamber. The device and the process have the beneficial effects that the problems such as oxidation and temperature reduction caused by a delivery process of a blank in a semi-solid temperature range are avoided, the temperature control is accurate and real-time monitoring is realized, thixoforming of high-melting-point alloy can be realized, the continuous work is stable and reliable, the anti-oxidation and the surface quality are high, the texture characteristic of a product is in gradient distribution, and the special use requirements can be met.

Description

technical field [0001] The invention belongs to the field of metal materials, and in particular relates to a high-melting-point alloy thixotropy forming device and a forming process. Background technique [0002] In the 1970s, Professor M. C. Flemings of the Massachusetts Institute of Technology and others created the concept, theory and technology of metal semi-solid forming (Document 1: Metallurgical Transactions, 1972, 3 (7): 1925-1932). Semi-solid processing is a technology that utilizes the unique rheological properties of metal materials in the state of solid-liquid coexistence. Firstly, it is necessary to prepare a solid-liquid mixed slurry containing a certain volume ratio of non-dendritic solid phase. There are two forming methods: rheological forming and thixoforming. Thixotropic forming refers to the forming method of cooling and solidifying the non-dendritic semi-solid billet obtained by controlling the solidification process, cutting it according to the require...

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Problems solved by technology

[0006] The purpose of the present invention is to overcome the problems of oxidation and temperature drop caused by billet transportation in the thixoforming process, to provide a device for one-step thixoformation of high-melting point semi-solid alloy billets, and to use materials in semi-solid The different flow mechanisms of liquid and solid phases in the interval can obtain the production process of parts with different internal and external tissue and gradient distribution

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