High-power LED packaging adhesive composition
A technology of LED encapsulation and composition, applied in non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problem that the reliability of epoxy resin encapsulation compound and the performance of UV resistance and aging resistance cannot meet the requirements of use, etc. problem, to achieve a good test effect
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Embodiment 1
[0023] A component: 70 parts of hydroxyl-terminated monophenyl polysiloxane, 0.003 parts of platinum catalyst; the viscosity of hydroxyl-terminated monophenyl polysiloxane at a temperature of 25°C is 5500mPa·s, and the content of platinum in the platinum catalyst is 2wt% .
[0024] Component B: 10 parts of methyl hydrogen-containing silicone oil, 3 parts of 1,4-biphenylbutadiyne, 3 parts of high-phenyl hydrogen-containing silicone oil; the phenyl molar content of high-phenyl hydrogen-containing silicone oil is greater than 30%, and the Ratio greater than 1.50, viscosity less than 700mPa·s;
[0025] Mix and defoam components A and B in a planetary defoamer, then perform the first curing at a temperature of 60°C for 1.5 hours, and then perform the second curing at a temperature of 140°C for 3 hours. The high-power LED encapsulation adhesive composition sample 1 was obtained.
Embodiment 2
[0027] Component A: 75 parts of methoxy-terminated bisphenyl polysiloxane, 0.005 parts of platinum catalyst; the viscosity of methoxy-terminated bisphenyl polysiloxane at a temperature of 25°C is 7000mPa·s, and the amount of platinum in the platinum catalyst is The content is 2wt%.
[0028] Component B: 12 parts of methyl hydrogen silicone oil, 4 parts of 3,4-diphenyl-1,5-hexadiyn-3,4-diol, 2 parts of high phenyl hydrogen silicone oil; high phenyl content The phenyl molar content of hydrogen silicone oil is greater than 30%, the refractive index is greater than 1.50, and the viscosity is less than 700mPa·s;
[0029] Mix and defoam components A and B in a planetary defoamer, then perform the first curing at a temperature of 58°C for 2 hours, and then perform the second curing at a temperature of 142°C for 2.5 hours. The high-power LED encapsulation adhesive composition sample 2 was obtained.
Embodiment 3
[0031] Component A: 65 parts of amino-terminated monophenyl polysiloxane, 0.002 parts of platinum catalyst; the viscosity of amino-terminated monophenyl polysiloxane at a temperature of 25° C. is 5000 mPa·s, and the content of platinum in the platinum catalyst is 2 wt % .
[0032] Component B: 11 parts of methyl hydrogen-containing silicone oil, 1 part of 1,4-biphenylbutadiyne, 1 part of a mixture of 1-phenyl-1-pentyne, 3 parts of high-phenyl hydrogen-containing silicone oil; high-phenyl The phenyl molar content of hydrogen-containing silicone oil is greater than 30%, the refractive index is greater than 1.50, and the viscosity is less than 700mPa·s;
[0033] Mix and defoam components A and B in a planetary defoamer, then perform the first curing at a temperature of 62°C for 1.5 hours, and then perform the second curing at a temperature of 138°C for a curing time of 3 hours. The high-power LED encapsulation adhesive composition sample 3 was obtained.
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