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Slicing device

A slicing device and slicing technology, which are applied to fine working devices, grinding workpiece supports, grinding machines, etc., can solve the problems of poor workability and complicated procedures, and achieve the effect of improving workability and easy installation.

Inactive Publication Date: 2015-05-13
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In Patent Document 1, after bonding the workpiece to the backing plate, it is necessary to further attach the backing plate to the work plate, and the process required to fix the workpiece to the slicing device is complicated, so there is a problem of poor workability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0051] figure 1 It is an overall configuration diagram of the wire saw (slicing device) in this embodiment.

[0052] The wire 3 is regularly wound around the supply side reel 6 a like a wire, and the wire 3 drawn out therefrom is wound around the guide pulley 2 . The wire 3 wound around the guide pulley 2 in multiple turns is then wound around the recovery side reel 6b to be recovered. The guide wheel 2 has a cylindrical shape, and for example, urethane rubber is attached to the outer peripheral surface, and a plurality of grooves of 100 to 2,000 places are engraved on the urethane surface in the circumferential direction at predetermined intervals. This guide wheel 2 is arrange|positioned plurally, and specifically, about 2-4 are arrange|positioned. One wire 3 passes through each mechanism part and is connected without being cut halfway.

[0053] There are a fixed abrasive method and a free abrasive method in the processing method using a wire saw. The fixed abrasive met...

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PUM

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Abstract

The objective of the utility model lies in providing a slicing device enabling an installation process, which is not easy to carry out in the prior art, of a machined object in a device to be easily carried out. The slicing device is arranged to slice the machine object installed on a main surface of a beam through a wire. The slicing device is characterized in that the slicing device is provided with a clamping device which directly clamps the side surfaces of the beam.

Description

technical field [0001] The invention relates to a slicing device. Background technique [0002] As a device for slicing an ingot into a wafer having a predetermined thickness, there is a slicing device (wire saw). In a conventional slicing device (for example, Patent Document 1), a workpiece is fixed on a work plate by a backing plate (process jig for bonding). [0003] Figure 9 It shows the mounting part of the workpiece in the conventional slicing device. The mounting jig 150 is mounted on the working board 152 . A through hole 154 is provided in the working plate 152 . The through hole 154 has a support step portion 155 , a small-diameter hole 156 at the lower portion of the support step portion 155 , and a large-diameter hole 157 at the upper portion. Fastening bolts 158 are arranged in the through holes 154 . [0004] The side L-shaped clamping claw 160 is composed of a main body 162 provided in the vertical direction and a fastening portion 164 protruding lateral...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/06B24B41/06B28D5/04B28D7/04
CPCB28D5/0088B28D5/045
Inventor 田代功高桥正行
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD