Electronic packaging part

Abstract

The utility model discloses an electronic packaging part, and the packaging part comprises a substrate, packaging glue bonded to the substrate, an electric contact pad, and an antenna structure. The antenna structure is provided with a first extension part and a second extension part, which are disposed on two opposite surfaces of the substrate. Moreover, a connecting part is disposed between the first and second extension parts at intervals. The electric contact pad is electrically connected to the second extension part. The electric contact pad is used for the fine tuning of the resonant frequency of the antenna, so that the resonant frequency of the antenna can be adjusted in a system environment or on a platform.

Description

technical field [0001] The invention relates to an electronic package, especially an electronic package with an antenna structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the appearance design requirements of consumer electronics products, the manufacture and design of wireless communication modules are developed towards light, thin, short and small requirements. Among them, the planar antenna (Patch Antenna) is small in size, light in weight and easy to manufacture. It is widely used in wireless communication modules of electronic products such as mobile phones (cell phone) and personal digital assistants (Personal Digital Assistant, PDA). [0003] figure 1 It ...

AI Technical Summary

Problems solved by technology

[0004] However, in the existing wireless communication module 1, the antenna structure 12 is planar, so based on the electromagnetic radiation characteristics between the antenna structure 12 and the electronic component 13 and the volume limitation of the antenna structure 12, during the manufacturing process, the The antenna body 120 is difficult to integrate with the electronic component 13, that is, the encapsulant 11 only covers the electronic component 13, but not the antenna body 120, so that the mold for the packaging process needs to correspond to the layout area of ​​these electronic components 13, and Does not correspond to the size of the substrate 10, which is not conducive to the packaging process

[0005] In addition, because the antenna structure 12 is planar, it is necessary to increase the layout area (the area where the encapsulant 11 is not formed) on the surface of the substrate 10 to form the antenna body 120, which makes it difficult to reduce the width of the substrate 10, thus making it difficult to Reduce the width of the wireless communication module 1, so that the wireless communication module 1 cannot meet the miniaturization requirements

[0006] Also, the development of SiP modules has the benefits of high integration and miniaturization, but in most SIP integrated antenna structures, it is impossible to fine-tune the resonant frequency of the antenna structure 12 after packaging, so the performance of the antenna will be affected by the system environment or platform. great influence

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