Swelling agent coating and heating device and operation method thereof

Abstract

A swelling agent coating and heating device comprises a cover, a heating device and a swelling agent coating device, wherein the cover is of a hollow cuboid structure without a lower bottom surface, a first cavity is formed inside the cover, the cover enables an anisotropic conductive film in a terminal area to be buckled in the first cavity, the heating device and the swelling agent coating device are fixed to the cover and are communicated with the cover, the heating device provides hot air for the first cavity, and the anisotropic conductive film in the first cavity is coated with a swelling agent through the swelling agent coating device. The invention further provides an operation method of the swelling agent coating and heating device. Due to the fact that the swelling agent coating and heating device comprises the cover, the heating device and the swelling agent coating device, the swelling agent does not need to be coated through a manual method, harm to the body caused when an operator makes contact with the swelling agent for a long time can be avoided, meanwhile, the swelling time of the swelling agent is shortened, and working efficiency is effectively improved.

Description

technical field [0001] The invention relates to the field of cleaning devices, in particular to a swelling agent coating heating device. Background technique [0002] With the rapid development of electronic products towards lightness, thinness and miniaturization, almost all kinds of portable electronic products use liquid crystal displays as display panels, especially in camcorders, notebook computers, desktop computers, smart TVs, mobile terminals or In products such as personal digital processors, liquid crystal displays are already an important component. [0003] The liquid crystal display includes a glass substrate display module and an integrated circuit system (Integrated Circuit; IC) disposed in the terminal area of ​​the glass substrate. Usually, the integrated circuit system is crimped and solidified on the terminal area of ​​the glass substrate through anisotropic conductive film (Anisotropic Conductive Film; ACF). The conductive particles contained in the con...

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Problems solved by technology

[0007] The above cleaning method requires manual dipping and coating of the RP-04 solution, and the operator’s long-term contact with the RP-04 solution will cause certain harm to the body; moreover, the RP-04 solution swells the anisotropic conductive film 207 at room temperature, The swelling speed is slow, the operator has to wait for a long time to remove the anisotropic conductive adhesive film 207, the work efficiency is low, and there may also be problems of incomplete swelling

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