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Workpiece processing device

A technology for processing devices and workpieces, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as inconvenient and flexible, and achieve the effects of improving workpiece processing efficiency, simple structure, and convenient use

Active Publication Date: 2015-05-20
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this machine effectively utilizes the use space of the wafer carrier to achieve the purpose of increasing production capacity and reducing costs, however, when wafers of different sizes need to be processed, the entire wafer carrier needs to be replaced accordingly. Medium, not convenient and flexible enough

Method used

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  • Workpiece processing device
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Embodiment Construction

[0024] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0025] refer to figure 1 , discloses a schematic cross-sectional structure diagram of the first embodiment of the workpiece processing device of the present invention. Such as figure 1 As shown, the workpiece processing device includes a process chamber 110 and a workpiece carrying mechanism 210 . A "workpiece" as used herein may be a wafer, substrate, substrate, or the like.

[0026] The process chamber 110 has a top wall 111, two pairs of side walls 112 and a bottom wall 113 opposite to the top wall 111. The top wall 111 of the process chamber 110, the two pairs of side walls 112 and the bottom wall 113 form a space to accommodate Workpieces are processed. A side wall 112 of the process chamber 110 is provided with a workpiece inlet ...

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Abstract

The invention discloses a workpiece processing device comprising a process cavity and a workpiece bearing mechanism. The workpiece bearing mechanism comprises a large chuck, a plurality of small chucks and at least one group of support columns. The large chuck is accommodated in the process cavity. An accommodating space is formed by the bottom and the side wall of the large chuck in a surrounding manner. The small chucks are accommodated in the accommodating space and each small chuck comprises a chuck body. A plurality of accommodating cavities are formed in the top of each small chuck downwardly to accommodate a plurality of workpieces. The support columns can be accommodated in a group of through holes of the large chuck and insertion holes, corresponding to the through holes, of the small chucks so as to take and place the workpieces. Through the small chucks with the accommodating cavities, when the workpieces same or different in size and shape need to be processed, the small chucks with the accommodating cavities in corresponding size and shape are selected and are placed in the accommodating space of the large chuck, and replacement of the whole large chuck is not needed, so that the workpiece processing device is convenient and flexible to use, simple in structure and capable of processing multiple workpieces at the same time, workpiece processing efficiency is improved, and workpiece processing cost is reduced.

Description

technical field [0001] The invention relates to a workpiece processing device, in particular to a workpiece processing device capable of processing multiple workpieces at the same time. Background technique [0002] With the increasingly fierce competition in the semiconductor industry, in the semiconductor process, in addition to strict requirements on process quality, manufacturers are also constantly seeking new ways to improve process efficiency and reduce process costs. This new way includes improving Processing equipment and / or improving process flow. [0003] For example, Chinese patent application CN200810126565.9 discloses a device that can process multiple substrates in batches, the device includes a chamber body, three or more support columns and a plurality of support teeth extending from the three or more support columns , slots are formed between adjacent supporting teeth to support the substrate. When processing the substrates, a plurality of substrates are ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
CPCH01L21/68785
Inventor 王坚贾照伟张怀东王晖
Owner ACM RES SHANGHAI
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