Ejector pin mechanism and plasma processing equipment
A thimble and workpiece technology, which is applied in the manufacture of semiconductor/solid-state devices, discharge tubes, electrical components, etc., can solve the problems of the complex structure of the thimble mechanism 16, the low adjustment precision, and the complex adjustment process, so as to shorten the level adjustment time and improve the Levelness, the effect of improving process quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0028] To enable those skilled in the art to better understand the technical solutions of the present invention, the thimble mechanism and plasma processing equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0029] Figure 4 This is a perspective view of the ejector pin in the ejector pin mechanism provided by the first embodiment of the present invention. Figure 5 For the edge Figure 4 A cross-sectional view taken along the line A-A'. Please refer to Figure 4 with Figure 5 The thimble mechanism includes at least three thimble pins 20 and a bracket for supporting the thimble 20. An elastic member 21 is arranged between each thimble 20 and the bracket. The height of the elastic member 21 can be within the elastic range under pressure. The change occurs, and the height of the thimble 20 relative to the bracket is changed.
[0030] Combine below Figure 5 The specific structure between the thimble 20, the el...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap