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Ejector pin mechanism and plasma processing equipment

A thimble and workpiece technology, which is applied in the manufacture of semiconductor/solid-state devices, discharge tubes, electrical components, etc., can solve the problems of the complex structure of the thimble mechanism 16, the low adjustment precision, and the complex adjustment process, so as to shorten the level adjustment time and improve the Levelness, the effect of improving process quality

Active Publication Date: 2015-05-27
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0006] However, the following problems often exist in the adjustment process: since only one side of the bracket 163 is provided with the lifting mechanism 162, the bracket 163 fixing the three thimbles 161 is a cantilever beam relative to the lifting mechanism 162, and only by adjusting This adjustment screw is used to adjust the levelness of the plane formed by three thimbles 161, so that the accuracy of adjustment is low; Complicated, making the adjustment process complicated and time-consuming

Method used

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  • Ejector pin mechanism and plasma processing equipment
  • Ejector pin mechanism and plasma processing equipment
  • Ejector pin mechanism and plasma processing equipment

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Embodiment Construction

[0028] In order for those skilled in the art to better understand the technical solutions of the present invention, the thimble mechanism and plasma processing equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0029] Figure 4 The perspective view of the thimble in the thimble mechanism provided by the first embodiment of the present invention. Figure 5 for along Figure 4 The cross-sectional view of line A-A' in the middle. Please also refer to Figure 4 and Figure 5 , the thimble mechanism includes at least three thimbles 20 and a bracket for supporting the thimble 20, an elastic member 21 is arranged between each thimble 20 and the bracket, and the height of the elastic member 21 can be within the elastic range under pressure changes, and the height of the thimble 20 relative to the bracket changes.

[0030] Combine below Figure 5Describe in detail the specific structure among the thimble 20...

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Abstract

The invention provides an ejector pin mechanism and a piece of plasma processing equipment. The ejector pin mechanism comprises at least three ejector pins and a holding bracket used for supporting the ejector pins. An elastic component is arranged between each ejector pin and the holding bracket. The heights of the elastic components can change within an elastic range under the action of pressure, which makes the heights of the ejector pins change relative to the height of the holding bracket. The ejector pin mechanism provided by the invention can improve the precision of horizontal adjustment, which enables the machining requirement and the assembly precision requirement on other components of the ejector pin mechanism to be lowered to a certain extent. Moreover, the ejector pin mechanism can help to shorten the time of horizontal adjustment and improve the work efficiency.

Description

technical field [0001] The invention belongs to the field of semiconductor equipment manufacturing, and in particular relates to a thimble mechanism and plasma processing equipment. Background technique [0002] Physical vapor deposition (Physical Vapor Deposition, hereinafter referred to as PVD) equipment is widely used to prepare thin films on the surface of the workpiece to be processed. Before using PVD equipment to prepare thin films on the surface of the processed workpiece, it is usually necessary to transport the processed workpiece to the degassing chamber to complete the degassing process, that is, the processed workpiece is heated to about 350 ° C to remove the surface of the processed workpiece. Water vapor and other volatile impurities. [0003] figure 1 A schematic diagram of the degassing chamber. figure 2 It is a schematic diagram of the structure of the processed workpiece placed on the surface of the heating plate. image 3 It is the top view of the th...

Claims

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Application Information

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IPC IPC(8): H01L21/687H01J37/32
CPCH01J37/32009H01L21/67011H01L21/68764H01L21/68785
Inventor 张伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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