Chip lamination device
A technology of lamination equipment and chips, applied in the directions of lamination, press, lamination device, etc., can solve the problem of uneven color difference of the display panel, so as to solve the problem of warping, improve uneven color difference, and improve product quality Effect
Active Publication Date: 2015-06-10
BOE TECH GRP CO LTD +1
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Problems solved by technology
Since heat is conducted from the indenter through the chip to the display panel during the pressing process, the thermal expansion of the chip is greater than that of the display panel below, resulting in the display panel being affected by the cooling of the chip after the pressing is completed. warping upward
This warping will cause uneven color difference in the picture of the display panel, that is, mura
Method used
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Embodiment Construction
[0029] In order to improve the warpage of the display panel during the chip bonding process, thereby improving the uneven chromatic aberration of the display screen of the display panel and improving product quality, an embodiment of the present invention provides a chip bonding device. In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following examples are given to further illustrate the present invention in detail.
[0030] Such as Figure 1 to Figure 3 As shown, the chip pressing device provided by the embodiment of the present invention includes a base 1, a thermal pressing head 2 (with a heating rod 10a arranged inside) and a cushion 3, wherein the pressing surface 4 of the base 1 has a set convex Degree l.
[0031] The chip pressing device can press the chip 8 with the pressing end 7 of the display panel 6. The pressing end 7 of the display panel 6 is provided with an anisotropic conductive glue 9. The thermal pressi...
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Abstract
The invention discloses a chip lamination device for solving the warping problem of a display panel, produced in a chip lamination process, so as to improve the non-uniform aberration of a display picture of the display panel and product quality. The chip lamination device comprises a base, a hot-pressing head and a buffer pad, wherein the pressure bearing face of the base has certain convexity degree. In the technical scheme, the pressure bearing face of the base has certain convexity degree, so that the display panel is stressed in the chip lamination process and is downwards and slightly bent. After chip lamination is completed, the display panel is upwards bent due to the influence of chip contraction, the deformation amount of upward bending can be offset with the deformation amount of downward bending, accordingly the warping problem of the display panel in the existing chip lamination process is solved, further the non-uniform aberration of the display picture of the display panel is improved, and the product quality is improved.
Description
Technical field [0001] The present invention relates to the technical field of display panel manufacturing, in particular to a chip pressing device. Background technique [0002] The chip pressing technology of the display panel refers to the use of a heated pressing head, under a certain temperature, pressure and pressure time, and cushioning the chip to press the chip, so that the chip and the display panel are set at the pressing end. The anisotropic conductive glue reacts to achieve the purpose of bonding the chip and the display panel and electrically connecting the chip and the display panel. Since the heat is transferred from the pressure head to the display panel through the chip during the lamination process, the thermal extension of the chip is greater than that of the display panel below, resulting in the display panel being cold-shrinked by the chip after the lamination is completed Affect and warp upward. This kind of warping will cause uneven chromatic aberration,...
Claims
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Login to View More IPC IPC(8): H01L21/67
CPCB32B37/0015B30B15/061B29C51/18B32B2457/20B29C43/18B29C43/52B29L2031/3475B29C43/021B29C43/00
Inventor 张永明夏业磊
Owner BOE TECH GRP CO LTD