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Wafer clamp

A wafer and fixture technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as leakage, reduced quality and reliability of semiconductor components, and failure of semiconductor components, so as to improve process yield and reduce ionization. Effect of probability of transfer to wafer

Active Publication Date: 2015-06-10
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, these pollutants may cause the leakage of the p-n junction of the device, shorten the lifetime of the minority carriers, reduce the breakdown voltage of the gate oxide layer, corrode the metal wire and other problems, resulting in a reduction in the quality and reliability of the semiconductor device. Even cause semiconductor components to fail

Method used

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Embodiment Construction

[0045] An embodiment of applying the wafer holder of the present application to an ion implanter is proposed below to illustrate related technical solutions. Of course, after referring to the content of the present application, those skilled in the art should understand that the wafer fixture of the present application can also be applied to other process equipment with similar working environments and similar requirements, for example, chemical vapor deposition ( Chemical vapor deposition (CVD) equipment or a physical vapor deposition (physical vapor deposition, PVD) equipment to reduce the probability of wafer contamination, thereby improving process yield.

[0046] Figure 1A It is a schematic diagram of a wafer fixture applied to an ion implanter according to an embodiment of the present application. Figure 1B yes Figure 1A A partially enlarged schematic diagram of the wafer holder and moving arm. Please see first Figure 1A , the ion implanter 1 includes a cavity 2 , a...

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Abstract

The invention discloses a wafer clamp comprising a first clamping member and a second clamping member. The first clamping member comprises a first plate and a first clamping claw connected to the first plate; the second clamping member is located on one side of the first clamping member and comprises a second plate and a second clamping claw connected to the second plate. The first clamping member and the second clamping member move correspondingly to clamp or release a wafer. When the first clamping member and the second clamping member get closer, the first clamping claw and the second clamping claw support the side of the wafer in a pressed manner, and the perpendicular projection of the first and second plates on the wafer at least covers a circular region of the center of the wafer.

Description

technical field [0001] The present application relates to a fixture, and in particular to a wafer fixture. Background technique [0002] In the semiconductor process, ion implantation is one of the processes. Ion implantation is mainly to convert the elements to be doped into ions (Ion Beam) and make them have enough energy and speed to implant the surface of the wafer or a specific position in it, so that the performance of the surface of the material is improved. [0003] When performing ion implantation, the wafer that was originally in the atmospheric state will be moved to the chamber in the high vacuum state, and then the wafer will be clamped to the carrier plate in the ion implantation area through the wafer clamp, and the wafer will be released and return to the position, and then the ion implanter starts to implant ions into the wafer. [0004] However, when the wafer holder travels back and forth to the ion implantation area, some ions will adhere to the edge of...

Claims

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Application Information

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IPC IPC(8): H01L21/687
Inventor 陈柏廷黎宇辜裕钦
Owner MACRONIX INT CO LTD
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