A method for manufacturing metallized half-holes in pcb
A technology of metallized semi-holes and manufacturing methods, which is applied in the manufacture of printed circuits, the formation of electrical connections of printed components, and electrical components. The effect of small drape and moderate curing degree
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Embodiment 1
[0021] refer to Figure 1-5 , the present embodiment provides a method for manufacturing metallized half-holes in a PCB, and the specific manufacturing steps are as follows:
[0022] (1) According to the circuit board production process of the prior art, the circuit board raw material is cut to obtain the substrate, and then the inner layer pattern transfer and etching are performed on the substrate to form the inner layer circuit on the substrate to obtain the inner layer core board. After the inner core board is pre-pressed, the inner core board and the copper foil are pressed together through the prepreg to form a multi-layer board.
[0023] Then, using the existing technology of laser drilling blind holes and mechanical drilling through holes, according to the drilling data, the edge slot holes and the slot holes in the board are made on the multi-layer board. And the multi-layer board is placed on the copper plating line and the full board electroplating line in turn to ...
Embodiment 2
[0033] This embodiment provides a method for manufacturing metallized semi-holes in a PCB. The specific manufacturing steps are basically the same as in Example 1, except that the temperature and time of the baking plate in step (2) are different, specifically: the baking plate It is carried out twice. First, bake the multilayer board at 58°C for 62 minutes, take it out and cool it naturally; then bake the multilayer board at 137°C for 43 minutes.
[0034] 1000 PCBs were produced by the manufacturing method of this embodiment, and there was no copper-free situation in the half-hole of the metallized plate on the PCB, and the edge of the half-hole of the metallized plate was smooth, without obvious edging, and the size of the edging 0.02mm. The half hole on the edge of the metallized plate is clean, and there is no resin ink residue in the plug hole.
Embodiment 3
[0036] This embodiment provides a method for manufacturing metallized semi-holes in a PCB. The specific manufacturing steps are basically the same as in Example 1, except that the temperature and time of the baking plate in step (2) are different, specifically: the baking plate It is carried out in two steps. First, bake the multi-layer board at 62°C for 58 minutes, take it out and let it cool naturally; then bake the multi-layer board at 133°C for 47 minutes.
[0037] 1000 PCBs were produced by the manufacturing method of this embodiment, and there was no copper-free situation in the half-hole of the metallized plate on the PCB, and the edge of the half-hole of the metallized plate was smooth, without obvious edging, and the size of the edging 0.02mm. The half hole on the edge of the metallized plate is clean, and there is no resin ink residue in the plug hole.
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