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Dual-interface card production method and device

A dual interface card and production method technology, applied in the field of mobile communication, can solve the problems of waste of raw materials, low yield, low production efficiency, etc., and achieve the effects of reducing production cost, high yield and high production efficiency

Active Publication Date: 2015-06-24
广东精毅科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One of the technical problems to be solved by the present invention is to provide a dual-interface card production method with high yield, raw material saving and high production efficiency in view of the defects of low yield, waste of raw materials and low production efficiency in the prior art

Method used

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  • Dual-interface card production method and device
  • Dual-interface card production method and device

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Embodiment Construction

[0047] In order to solve the defects of low welding efficiency and low production capacity of dual-interface cards in the prior art, the present invention provides a production method and equipment for dual-interface cards with high welding efficiency and high production capacity.

[0048] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.

[0049] figure 1 It is a schematic diagram of the manual production process of the dual-interface card in the prior art; the chip 301 on the dual-interface card includes a front side 100 and a back side 200, and the back side 200 has predetermined solder joints 2001. In the prior art, the chip 301 is manually welded to the card base 302 with the antenna to obtain the dual interface card 300 with the antenna card base, and the dual interface car...

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Abstract

The invention provides a dual-interface card production device and method. The dual-interface card production device comprises a chip turning device, wherein the chip turning device comprises a turning arm and 2N suction cups which are symmetrically arranged on the two sides of the turning arm, and the suction cups on one side of the turning arm are right opposite to chips to be sucked. Compared with the prior art, the chip welding efficiency is greatly improved by arranging a chip steering set and the chip turning device. The chip turning device is arranged into the structure that the chips are turned and sucked at the two ends, and compared with a traditional structure that the chips are sucked at one end, residual turning is reduced, the flow is simplified, a large amount of time is saved, and idle work applied by the chip turning device is reduced as well. The chip steering set is designed into two adsorption pieces, and through the cooperation with an X-axis servo motor, when one adsorption piece prepares for welding, the other adsorption piece can prepare for chip receiving, certain time is saved, and the production efficiency of the dual-interface card production device is greatly improved.

Description

technical field [0001] The invention relates to the field of mobile communication, more specifically, to a production method and equipment of a dual-interface card. Background technique [0002] With the rapid development of information technology and economy around the world, economic and information exchanges between people are becoming more and more frequent. Cards and contact CPU cards (smart cards) that are being used in many fields now. At present, smart cards still play an irreplaceable role in people's lives. Whether it is a contact smart card or a contactless smart card, it has its own advantages and disadvantages. The wear and tear between the contact smart card and the card machine greatly shortens its service life. . The application of non-contact cards is limited in the occasions where radio frequency interference is severe; secondly, due to the energy transfer through coupling, the power consumption is required to be very low; The technology and infrastructu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00G06K19/07
CPCB23K37/00B23K2101/36B23P15/00B23P23/06B65G47/248B65G47/91G06K19/07
Inventor 熊曙光
Owner 广东精毅科技股份有限公司
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