Intelligent power module and manufacturing method thereof
A technology of intelligent power modules and manufacturing methods, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the difficulties in the application and promotion of intelligent power modules, unfavorable popularization of intelligent power modules, and increase application costs, etc. problems, to achieve the effect of reducing application difficulty and application cost, improving reliability and manufacturability, and improving assembly quality
Active Publication Date: 2018-10-23
GD MIDEA AIR-CONDITIONING EQUIP CO LTD +1
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Problems solved by technology
If a radiator is added outside the intelligent power module, the radiator needs to be mounted on the back of the intelligent power module. On the one hand, the application cost is increased, and on the other hand, the assembly difficulty is increased, which creates difficulties for the application and promotion of the intelligent power module. Conducive to the popularization of intelligent power modules in civilian applications
Method used
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Embodiment Construction
[0047] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
[0048] The intelligent power module 10 according to the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
[0049] Referring to Fig. 1(A), Fig. 1(B) and Fig. 1(C), an intelligent power module 10 according to an embodiment of the present invention includes a radiator 17, an insulating layer 21, a plurality of circuit wiring 18, power elements 19, A non-power element 14 , a plurality of pins 11 and a sealing resin 12 .
[0050]Specifically, the upper surface of the r...
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The invention discloses an intelligent power module and a manufacture method thereof. The intelligent power module comprises a radiator, an insulation layer, a plurality of circuit wirings, power components and non-power components, a plurality of pins and a sealed resin, wherein the upper surface of the radiator forms a plane, and the lower surface of the radiator is provided with a radiating fold, the insulation layer is arranged on the upper surface of the radiator, the plurality of the circuit wirings are arranged on the insulation layer at intervals, the power components and the non-power components are respectively arranged on the plurality of the circuit wirings, and electrically connected with the plurality of the circuit wirings through metal wires, one end of each pin is connected with each circuit wiring, and the other end of each pin is connected with an outer portion, and the sealed resin fully seals the plurality of the circuit wirings and covers the upper surface of the radiator. The intelligent power module is good in heat dispersion, high in reliability and powerful in manufacturability.
Description
technical field [0001] The present invention relates to the technical field of electronic devices, and more specifically, to an intelligent power module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module, or IPM (Intelligent Power Module), is a power drive product that combines power electronics and integrated circuit technology. The intelligent power module integrates the power switching device and the high-voltage driving circuit, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the intelligent power module receives the control signal from the MCU to drive the subsequent circuit to work, and on the other hand, it sends the system status detection signal back to the MCU. Compared with traditional discrete solutions, intelligent power modules have won an increasing market due to their advantages of high integration and high reliability. They are especially suitable for invert...
Claims
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IPC IPC(8): H01L23/34H01L23/36H01L21/48
CPCH01L2224/48091H01L2224/48137H01L2224/48472H01L2924/13055H01L2924/13091H01L2924/19105H01L2924/00014H01L2924/00
Inventor 冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD