Method for processing circuit board and circuit board

Abstract

The embodiment of the invention discloses a circuit board processing method and a circuit board. The circuit board processing method comprises the steps of processing first blind grooves in N circuit graphic areas on the first face of a first conductive metal matrix; machining second blind grooves in N circuit areas on the second face of the first conductive metal matrix; removing a part of all conductive metal in non-circuit graphic areas on the first conductive metal matrix to enable conductive metal at the bottoms of the first blind grooves formed in the N circuit graphic areas on the first face to form N layers of circuit graphics and forming first conductive metal blocks on the first conductive metal matrix; enabling orthographic projection of each layer of circuit graphics in at least two layers of circuit graphics in the N layers of circuit graphics on at least one vertical section of the first conductive metal matrix to be partially or wholly located on the orthographic projections of the first conductive metal blocks. By means of the technical scheme, reduction of the thickness of a PCB including the ultra-thick first conductive metal blocks is facilitated.

Description

Technical field [0001] The invention relates to the technical field of circuit board processing and manufacturing, in particular to a method for processing circuit boards and circuit boards. Background technique [0002] At present, printed circuit boards (PCBs) containing ultra-thick copper are increasingly used in many products. For example, high-power PCBs are required in many scenarios, such as high-power power amplifier PCBs, automotive electronics PCBs, and other electronic products that require high current (such as current> 5A or 30A) and signals at the same time. [0003] At present, such high-current PCBs usually use conductive metal blocks for large currents directly embedded in the circuit layer (the conductive metal blocks for large currents are referred to as high-current conductive metal blocks, and large-current conductive metal blocks The material is copper for example). [0004] Based on the existing multi-layer PCB processing mechanism, because the embedding o...

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Problems solved by technology

[0004] Based on the existing multi-layer PCB processing mechanism, because the embedding of ultra-thick conductive metal blocks (such as high-current conductive metal blocks) generally requires the use of correspondingly thick inner core boards and ultra-thick dielectric layers, resulting in the processing of PCBs with ultra-thick conductive metal blocks will become relatively thick because the core board is too thick, which also greatly affects the miniaturization and integration of PCBs containing ultra-thick conductive metal blocks.

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