A new water-cooled plate structure using 3D printing technology

Abstract

The invention discloses a novel water cooling plate structure applying the 3D printing technology. An internal channel of a cooling plate base body comprises a plurality of trapezoid main water channel bodies and circular hole micro channels. A water inlet is communicated with the trapezoid main water channel body on the water inlet side of the cooling plate base body, and a water outlet is communicated with the trapezoid main water channel body on the water outlet side of the cooling plate base body. The trapezoid main water channel bodies on the water inlet side and the water outlet side in the cooling plate base body are independently arranged, and the other trapezoid main water channel bodies are arranged in pairs. A communicating port is arranged at the wide bottom edge between every two trapezoid main water channel bodies arranged in pairs, and the portions, except the communicating ports, between the trapezoid main water channel bodies are provided with gaps. The trapezoid main water channel bodies are communicated with the circular hole micro channels. Compared with the prior art, the novel water cooling plate structure has the advantages that no water leakage hidden danger exists, water flows in the micro hole micro channels more evenly by the adoption of the trapezoid main water channel bodies, the radiating area is increased through the multiple layers of circular hole micro channels, heat absorption is more sufficient, water flow resistance force is reduced, and the water cooling plate radiating efficiency is improved.

Description

technical field [0001] The invention relates to water cooling and heat dissipation technology, in particular to a novel water cooling plate structure applying 3D printing technology. Background technique [0002] With the development of electronic technology, the size of electronic equipment is getting smaller and smaller, the assembly density is getting higher and higher, and the overall power dissipation is increasing sharply. The problem of heat dissipation that causes high heat flow in electronic equipment has become increasingly prominent. When electronic equipment does not have good heat dissipation performance, it will have a significant impact on the performance and life of the entire equipment. At present, cold plates are mostly used to dissipate heat from high-density electronic equipment. [0003] The water-cooled plate is a common heat exchanger, which has the characteristics of light weight, small size, and large heat dissipation. The design of its internal flo...

AI Technical Summary

Problems solved by technology

At present, the common processing of water-cooled plates is to use milling to process heat-dissipating fins and then integrally weld them into shape. There are problems such as limited fin height and excessive fin gap (generally not less than 3mm), the heat dissipation efficiency is not high, and it is difficult to achieve heat dissipation. Requirements, and need a large area of ​​sealing, there is a hidden danger of water leakage

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