Three-dimensional nondestructive measurement method and three-dimensional nondestructive measurement device for object with complex outline
A measurement device and measurement method technology, applied in the field of three-dimensional measurement, can solve the problems of inability to measure uneven density, difficult to meet actual production needs, inability to measure, etc., and achieve the effects of convenient measurement, low cost, and accurate displacement requirements.
Inactive Publication Date: 2015-07-22
GUILIN UNIV OF ELECTRONIC TECH
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Due to the virtual slice principle adopted by this method, the measurement is carried out in a balanced system without destroying the measured object, but this method also requires the measured object to have a uniform density, and it cannot measure objects with uneven density
Therefore, in terms of non-destructive measurement of three-dimensional objects with internal contours, the above methods can only measure objects with uniform density, but cannot measure objects with uneven density with complex internal contours, which is difficult to meet actual production needs
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[0030] The measurement method for reconstructing a three-dimensional object by constructing an ordered point cloud from grid layered volume measurement is:
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Abstract
The invention discloses a three-dimensional nondestructive measurement method and a three-dimensional nondestructive measurement device for an object with a complex outline. The three-dimensional nondestructive measurement method comprises the following steps of layering and dividing a measured object into a plurality of ordered small grid bodies by using a grid dividing method; measuring volumes of the small grid bodies of each layer in different directions by using a precise displacement control system and a volume measurement system; establishing a mathematical model; performing smart calculation so as to solve three-dimensional coordinate dimensions of the small grid bodies of the object by using a genetic algorithm and the like; and designing a three-dimensional reconstruction method based on a layering feature so as to perform graph reconstruction on the small grid bodies of the object. By the measurement method, the measured object is not damaged, all materials which cannot be dissolved in water, do not have closing holes and are in the complex shapes can be measured conveniently, the cost is low, obtained three-dimensional coordinate point cloud data are layered orderly, reconstruction is simple, and objects can be measured automatically. A theory of the technology can be used for the fields of computer aided design and manufacture, rapid prototyping, virtual reality and the like, technological difficulties of reverse engineering and rapid prototyping in the prior art are solved, and the three-dimensional nondestructive measurement method and the three-dimensional nondestructive measurement device for the object with the complex outline have quite important theoretic value and a wide application prospect.
Description
technical field [0001] The invention relates to three-dimensional measurement technology, in particular to a method and device for three-dimensional non-destructive measurement of objects with complex contours. Background technique [0002] In terms of three-dimensional measurement technology for the internal and external contours of objects, there are currently nuclear magnetic resonance imaging and CT scanning methods that can measure the internal contours of objects, but these two methods are very expensive and have limitations on the size and materials of measurable parts. Low precision. Another method capable of measuring the internal contour of an object is the automatic tomography technology in the United States, although this method has high measurement accuracy. But it will destroy the parts under test when it is measured, the cost is high, the measurement time is long, and the application is also limited. In addition, a non-contact measurement and reconstruction ...
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IPC IPC(8): G01B13/16
CPCG01B13/16
Inventor 甘勇莫宗杰甘杜芬
Owner GUILIN UNIV OF ELECTRONIC TECH
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