Resistance welding method for windowed rigidity-flexibility combined circuit board

A rigid-flex, circuit board technology, used in printed circuits, printed circuit manufacturing, printed circuit secondary processing, etc., can solve problems such as poor appearance and unacceptable customer acceptance, and solve problems such as overflowing glue appearance or shrinking circuit erosion. Effect

Inactive Publication Date: 2015-07-22
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, since the rigid-flex circuit board is formed by pressing the rigid core board and the flexible board with PP, glue overflow is prone to occur at the junction of the rigid core board and the flexible board, and the amount of glue overflow can reach ±1.5mm (“+” Represents overflow, "-" represents shrinkage), when overflowing, it will cause poor appearance, which is unacceptable to customers; when shrinking, the lines at the retracted position will be exposed, and the developing stage will corrode the exposed lines at the retracted position

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A window-opening type rigid-flex circuit board solder resisting method includes the following steps in sequence: pretreatment, silk screen printing, pre-examination, exposure, and development. The technological process and parameters of each process are as follows:

[0024] S1 pre-processing

[0025] Process flow: plate micro-etching → overflow washing (1) → overflow washing (2) → surface sandblasting → flushing sewage → overflow washing (3) → ultrasonic cleaning → water column washing → WASTER BLAST DI washing → drying .

[0026] a. Micro-etch into the board: place the circuit board to be soldered in the liquid medicine in the micro-etching cylinder for micro-etching, so that the thickness of the micro-etch on the surface of the circuit board reaches 0.2-0.6 μm; 2 S 2 o 8 The mass concentration is controlled at 40-80g / L, H 2 SO 4 The mass fraction is controlled at 1-3%, Cu 2+ The mass concentration of ≤15g / L; micro-etching temperature control 26-34 ℃; micro-etch...

Embodiment 2

[0050] A window-opening type rigid-flex circuit board solder resisting method includes the following steps in sequence: pretreatment, silk screen printing, pre-examination, exposure, and development. The technological process and parameters of each process are as follows:

[0051] S1 pre-processing

[0052] Process flow: plate micro-etching → overflow washing (1) → overflow washing (2) → surface sandblasting → flushing sewage → overflow washing (3) → ultrasonic cleaning → water column washing → WASTER BLAST DI washing → drying .

[0053] a. Micro-etch into the board: place the circuit board to be soldered in the liquid medicine in the micro-etching cylinder for micro-etching, so that the thickness of the micro-etch on the surface of the circuit board reaches 0.2-0.6 μm; 2 S 2 o 8 The mass concentration is controlled at 60g / L, H 2 SO 4 The mass fraction is controlled at 2%, Cu 2+ The mass concentration is less than or equal to 15g / L; the micro-etching temperature is cont...

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PUM

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Abstract

The invention discloses a resistance welding method for a windowed rigidity-flexibility combined circuit board and relates to the field of production of circuit board products. The resistance welding method sequentially includes screen printing, exposure and development. A block spot screen is adopted for ink printing during screen printing, block spots on the block spot screen correspond to flexible areas on the circuit board, and each block spot is smaller than a single side of the corresponding flexible area by 0.15-0.25mm. By size adjustment of the block spots of the block spot screen, exposure of window edges of a rigidity core board outside a substrate is avoided after screen printing and resistance welding, the problem of ink accumulation in the flexible areas is prevented, and the problem of excessive glue or internal circuit erosion in lamination of the rigid core board and flexible boards is solved.

Description

technical field [0001] The invention relates to the production field of circuit board products, in particular to a window-opening type rigid-flex combined circuit board solder resistance method. Background technique [0002] There are many processing methods for rigid-flex circuit boards, and the window-opening processing method is one of them. The production method is that the rigid core board is directly pushed out of the window and then pressed with the flexible board (FPC). This method is suitable for FPC sandwiched between rigid core boards with a thickness of <0.25mm, and its advantages are low cost and short process. But because the FPC is exposed outside, and because the flexible board is sandwiched between the rigid core boards, there will be a certain drop between the flexible area of ​​the flexible core board corresponding to the window of the rigid core board and the surface of the rigid core board. Printing and silk screen solder mask form oil accumulation i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/28H05K2203/0766H05K2203/1105
Inventor 何淼覃红秀周长春宇超
Owner SHENZHEN SUNTAK MULTILAYER PCB
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