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Polyamide acid solution, polyimide film, preparation method and application method

A technology of polyimide film and polyamic acid is applied in the field of preparation of ultra-thin polyimide film, which can solve the problems of difficulty in developing ultra-thin polyimide film and the like

Active Publication Date: 2015-08-19
TAIMIDE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, limited by the process capability of known polyimide films, ultra-thin polyimide films are indeed difficult to develop
It is known that the thickness of the thinnest polyimide protective layer on the market can be less than 10 microns; however, it is almost impossible to prepare a polyimide film less than 5 microns by the existing biaxial stretching process The goal
Moreover, the operability of glue distribution in downstream applications must also be considered

Method used

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  • Polyamide acid solution, polyimide film, preparation method and application method
  • Polyamide acid solution, polyimide film, preparation method and application method
  • Polyamide acid solution, polyimide film, preparation method and application method

Examples

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preparation example Construction

[0040] For the preparation method of the polyimide film containing siloxane of the present invention, please refer to image 3 As shown, it includes the following steps:

[0041] Prepare a peelable base layer 10, which includes polyimide and siloxane structure, the siloxane structure is

[0042]

[0043] The n is a repeating unit, the silicon atom accounts for 1-12% of the total weight of the peelable base layer, and the Y is a diamine or a dianhydride. In addition, the polyimide can further include an R, which is an aliphatic group with 1-10 carbons, such as methyl, ethyl or propyl, or aromatic, to form the following structure

[0044] and

[0045] Coating a polyamic acid solution on the peelable base layer 10; heating the polyamic acid solution to form a polyimide layer 12 on the peelable base layer.

[0046] In addition, the peelable base layer 10 can be in a liquid state, and the polyamic acid system is heated together with the liquid peelable base layer, and baked...

Embodiment 1

[0063] Preparation of the first polyamic acid solution

[0064] Put 44.31 grams of ODA and 400 grams of solvent DMAc into a three-neck flask, stir at 30°C until completely dissolved, then add 5.89 grams of siloxane (PDMS), and then add 49.05 grams of PMDA after it is evenly mixed. , the monomer accounts for 20wt% of the total weight of the reaction solution. Then, the first polyamic acid solution was obtained by continuously stirring and reacting at 25° C. for 25 hours.

[0065] Preparation of the second polyamic acid solution

[0066] Put 47.85 grams of ODA and 400 grams of solvent DMAc into a three-neck flask, stir at 30°C until completely dissolved, then add 51.37 grams of PMDA, wherein the monomer accounts for 20wt% of the total weight of the reaction solution, and then continue stirring at 25°C And react for 25 hours to obtain the second polyamic acid solution.

[0067] Preparation of ultrathin polyimide film

[0068] Coat the obtained first polyamic acid solution on ...

Embodiment 2

[0070] The steps of Example 1 were repeated, but the components of the first polyamic acid solution were changed to 42.13 grams of ODA, 9.53 grams of PDMS, and 48.1 grams of PMDA. In this example, the monomers accounted for 20 wt% of the total weight of the reaction solution.

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Abstract

The present invention provides a siloxane-containing polyamide acid solution, a polyimide film and a method for preparing the polyimide film. According to the invention, the siloxane reacts with diamine / dianhydride in the polyamide acid solution to form the following structure of img file='DDA0000697968880000011.TIF' wi='873 he='343', wherein Y represents diamine / dianhydride. The film comprises a delaminated base layer and a polyimide layer. The delaminated base layer comprises a structure show in img file='DDA 0000697968880000012. tif'wi='845', he='317'. The polyimide layer is attached to the first surface of the delaminated base layer.

Description

technical field [0001] The invention relates to a polyamic acid solution containing siloxane, a polyimide film and a preparation method and application method thereof, in particular to a preparation method for manufacturing an ultrathin polyimide film. Background technique [0002] In the printed circuit board, in order to protect the metal circuit, a polyimide protective layer (coverlay) is usually disposed thereon. With the development of technology and product demand, the size of printed circuit boards tends to be light, thin, and multi-functional. Reducing the overall thickness of printed circuit boards is also an important development goal in the industry. Among them, the thinning of polyimide protective layer has become a One of the important indicators of the overall design of the printed circuit board. [0003] However, limited by the process capability of known polyimide films, it is indeed difficult to develop ultra-thin polyimide films. It is known that the thic...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C08J5/18
Inventor 林志维赖俊廷黄彦博
Owner TAIMIDE TECH
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