Conductive structure and manufacturing method thereof, array substrate, display device

Abstract

The invention provides a conductive structure and a manufacturing method thereof, an array substrate and a display device. The conductive structure includes multiple first metal layers made of aluminum, and a second metal layer is arranged between every two adjacent first metal layers, and the second metal layer is made of a metal other than aluminum. to make. The conductive structure provided by the present invention can reduce the number of single-layer first metal layers by arranging multiple layers of first metal layers made of aluminum, and setting up a second metal layer between every two adjacent first metal layers for barrier. The continuous length of the crystal grains in the layer can reduce the small protrusion phenomenon of the conductive structure when it is heated without reducing the overall thickness of the conductive structure.

Description

technical field [0001] The present invention relates to the display field, in particular to a conductive structure and a manufacturing method thereof, an array substrate, and a display device. Background technique [0002] Low temperature polysilicon (LTPS for short) TFT display devices are different from traditional amorphous silicon TFT display devices in that their electron mobility can reach 50-200cm2 / V-sec, which can effectively reduce the channel Therefore, the area of ​​the thin film transistor device is reduced to achieve the purpose of increasing the aperture ratio and the integration level, thereby increasing the brightness of the display and reducing power consumption. [0003] In the LTPS process, in order to reduce the line resistance, metal aluminum (Al) with low cost, high conductivity, and very small metal ion diffusion is generally used to make each signal line. However, in the subsequent Hydro (hydrogenation) process , due to the thermal expansion properti...

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Problems solved by technology

[0003] In the LTPS process, in order to reduce the line resistance, metal aluminum (Al) with low cost, high conductivity, and very small metal ion diffusion is generally used to make each signal line. However, in the subsequent Hydro (hydrogenation) process , due to the thermal expansion properties of pure aluminum itself, pure Al with a higher thickness is very prone to small protrusions (hillocks) on the surface when the grain direction is relatively consistent, which greatly affects the contact of the signal line and the subsequent optical inspection work

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