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Plastic packaging type IPM module stacking structure

A module stacking and plastic packaging technology, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of large overall volume of IPM modules, unstable IPM modules, and high material costs, so as to reduce early module failures The effect of risk reduction, volume reduction, and production cost reduction

Inactive Publication Date: 2015-09-02
XIAN YONGDIAN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] (1) The layout of the DBC board and PCB board inside the current IPM module is relatively scattered and occupies a large volume, which leads to a large overall volume of the IPM module and high material costs
[0006] (2) The PCB board in the plastic-encapsulated IPM module is the drive protection circuit, and the distance between the PCB board and the DBC board will cause unstable factors in the IPM module and the risk of early failure of the module

Method used

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  • Plastic packaging type IPM module stacking structure
  • Plastic packaging type IPM module stacking structure

Examples

Experimental program
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Embodiment Construction

[0023] The IPM module includes three key components: lead frame, DBC board and PCB board, the volume of these three determines the volume of the IPM module. The DBC boards and PCB boards in the current IPM module are scattered and occupy a large volume, which leads to a large overall volume of the IPM module and high material costs. In addition, the PCB board in the plastic-encapsulated IPM module is the drive protection circuit, and the distance between the PCB board and the DBC board will cause unstable factors in the IPM module, and there is a risk of early failure of the module.

[0024] Aiming at the deficiencies in the prior art, the present invention provides a plastic-encapsulated IPM module stacking structure, which shortens the distance between two sets of lead frames and stacks the PCB board above the DBC board, effectively reducing the size of the PCB board and the DBC board. The distance between the boards reduces the volume of the entire module, improves the inte...

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PUM

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Abstract

The invention discloses a plastic packaging type IPM module stacking structure. In the structure, a second lead frame group is close to one side of a first lead frame group. The distance between the two lead frame groups is shortened. One second lead frame group end with a welded PCB extends towards one side of the first lead frame group to make the PCB located above a DBC. A stacking structure is thus formed. The distance between the PCB and the DBC is effectively shortened. The volume of the whole module is reduced. The plastic packaging type IPM integrated level is improved. The risk of early-stage module failure due to the relatively large volume of the module during an injection moulding process can be reduced. The injection moulding material using amount is further reduced. The production cost is lowered.

Description

technical field [0001] The invention belongs to the field of plastic-encapsulated IPM production and manufacturing, and in particular relates to a stacked structure of plastic-encapsulated IPM modules. Background technique [0002] Plastic-encapsulated IPM (Intelligent Power Module, Intelligent Power Module) is a new type of control module that integrates the IGBT chip and its drive circuit, control circuit and overcurrent, undervoltage, short circuit, overheating and other protection circuits. It is a complex and advanced power module that can automatically realize complex protection functions such as overcurrent, undervoltage, short circuit and overheating, so it has intelligent features. At the same time, it has the advantages of low cost, miniaturization, high reliability, and easy use. It is widely used in frequency conversion home appliances, inverter power supplies, industrial control and other fields, and its social and economic benefits are considerable. [0003] F...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L25/00
CPCH01L2924/13055H01L2924/181H01L2224/48091H01L2224/48137H01L2224/48247H01L2224/0603H01L2924/00012H01L2924/00014H01L2924/00
Inventor 吴磊
Owner XIAN YONGDIAN ELECTRIC