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PCB silk screen processing method and system

A processing method and processing system technology, applied in the field of PCB silk screen processing method and system, can solve the problem of nowhere to place silk screen and so on

Inactive Publication Date: 2018-08-07
GUANGDONG VTRON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, the purpose of the present invention is to provide a PCB silk screen processing method and system for the problem of nowhere to place silk screen on high-density PCBs, which is easy to operate

Method used

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  • PCB silk screen processing method and system
  • PCB silk screen processing method and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] see figure 1 As shown, it is a schematic flow chart of Embodiment 1 of the PCB silk screen processing method of the present invention. Such as figure 1 As shown, the PCB silk screen processing method in this embodiment comprises the steps:

[0024] Step S101: Add an assembly layer file to the PCB casting file, wherein the assembly layer file includes the silk screen of the PCB, and proceed to step S102;

[0025] Wherein, the assembly layer file may be ASSEMBLY_TOP, or the assembly layer file may also be ASSEMBLY_BOTTOM;

[0026] Among them, the silk screen refers to the characters on the PCB;

[0027] The silk screen can specifically include the fool-proof design logo and device tag characters, which can be used to guide the direction and tag of the device before assembling the mount device or the plug-in device. The fool-proof design logo here is to prevent the device from being plugged in. opposite;

[0028] Specifically, at the end of the PCB design, an assembly...

Embodiment 2

[0036] Such as figure 2 As shown, it is a schematic flow chart of Embodiment 2 of the PCB screen printing processing method of the present invention. As mentioned above, the silk screen of the PCB needs to be added and the REF attribute needs to be added to the assembly layer file. In this embodiment 2, the process of adding the silk screen of the PCB and adding the REF attribute is limited to the process of establishing the device package library of the PCB Since the device package library is a necessary process for the PCB, therefore, during the process of building the device package library, adding the silkscreen and REF attributes of the PCB, rather than in another process, can make the entire process The process is smoother and the processing efficiency is improved.

[0037] see figure 2 As shown, the PCB silk screen processing method in this embodiment comprises the steps:

[0038] Step S201: add the assembly layer file in the PCB casting file, and enter step S202; ...

Embodiment 3

[0044] Such as image 3 As shown, it is a schematic flow chart of Embodiment 3 of the PCB silk screen printing processing method of the present invention. The difference between this embodiment 3 and embodiment 1 is that, considering that the device density is not higher than the preset threshold value in some cases, in order to increase the applicability of the solution of the present invention, in this embodiment, a For the screen printing display method when the device density is not higher than the preset threshold value.

[0045] see image 3 As shown, the PCB silk screen processing method in this embodiment includes the following steps:

[0046] Step S301: Add an assembly layer file to the PCB casting file, wherein the assembly layer file includes the silk screen of the PCB, and proceed to step S302;

[0047] Step S302: Add REF attributes to the assembly layer file, and enter step S303;

[0048] Step S303: Obtaining the device density of the PCB;

[0049] Step S304:...

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Abstract

The present invention relates to a PCB silk screen processing method and system. The method comprises the steps of: adding an assembly layer file in a PCB casting file, wherein the assembly layer file includes a PCB silk screen; adding a REF attribute to the assembly layer file; When the device density of the PCB is greater than a preset threshold value, the assembly layer file is displayed. The solution of the invention solves the problem that there is no extra space for silk screen printing when the device density on the PCB reaches a certain level. It can guide assembly and welding processes, give the order and direction of devices before assembly, and is easy to operate.

Description

technical field [0001] The invention relates to the technical field of circuit board printing, in particular to a PCB silk screen printing processing method and system. Background technique [0002] The current screen printing of components on the PCB (Print Circuit Board, ordinary printed circuit board) is often based on the principle of placing the screen nearby, that is to say, the screen printing is placed near the device, and the screen printing layer composed of silk screen appears on the surface of the device. package information. [0003] This method can be well applied to the case where the device density is not very high. However, for the ultra-high density (higher device density) PCB, the placement of the silk screen becomes a difficult problem, because generally one side of this PCB It is full of the same or different devices, and the spacing between devices is very small or even close to zero, resulting in no blank space for designers to place silk screens. Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K1/0266H05K3/0005
Inventor 周莹褚平由周丽
Owner GUANGDONG VTRON TECH CO LTD