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Liquid-and-gas bypass type heat exchange chamber

A technology of heat exchange cavity and liquid-gas diversion, which is applied in the direction of cooling/ventilation/heating transformation, etc., which can solve problems such as increased pressure, poor heat dissipation effect, heat transfer due to shear force, and transmission distance limitation, so as to reduce heat energy Loss, enhance the effect of heat exchange and cooling effect

Inactive Publication Date: 2015-09-02
AURAS ELECTRONICS SCI & TECH IND KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, after the liquid in the evaporation section evaporates into gas, the pressure will increase. Therefore, when the gas turns into liquid in the pipeline channel and returns from the original path, the shear force at the liquid-gas interface will generate additional resistance. Therefore, the maximum heat transfer, Transmission distance is limited
[0004] Therefore, those skilled in the art now have the two ends of the pipeline channel connected to a cavity, and hope that the gas enters one end of the pipeline channel from the cavity, becomes liquid in the pipeline channel, and then flows out of the pipeline channel. The other end returns to the cavity, forming a unidirectional circulation flow without pressure loss caused by the shear force on the liquid-gas interface; however, since there is no design in the cavity to prevent gas from entering either end of the pipeline channel, so Instead, the gas in the cavity enters the pipeline channel from both ends, and finally becomes a liquid, no matter whether it wants to return to the cavity from the original path or the other end, it is still hindered, so it still cannot make the liquid flow smoothly, and the overall Still poor heat dissipation

Method used

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  • Liquid-and-gas bypass type heat exchange chamber
  • Liquid-and-gas bypass type heat exchange chamber
  • Liquid-and-gas bypass type heat exchange chamber

Examples

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Embodiment Construction

[0048] In the following, the technical means adopted by the present invention to achieve the intended purpose of the invention will be further described in conjunction with the accompanying drawings and preferred embodiments of the present invention.

[0049] see figure 1 As shown, the first embodiment of the liquid-gas split heat exchange chamber of the present invention includes a chamber unit 100 , and the chamber unit 100 includes a chamber body 10 and a pipeline channel 20 .

[0050] see Figure 1 to Figure 4 As shown, the aforesaid cavity 10 is rectangular and has an internal space, and a partition 11 is provided in the cavity 10, and the partition 11 divides the internal space of the cavity 10 into a rectangular heating chamber 12 and a rectangular reflow chamber 13 (like figure 1 and figure 2 As shown), the partition 11 is penetrated with a plurality of fine channels 111, and the plurality of micro channels 111 are adjacent to the top side of the partition 11 and a...

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PUM

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Abstract

The invention relates to a liquid-and-gas bypass type heat exchange chamber which is a heat radiation device for a computer communication product. The liquid-and-gas bypass type heat exchange chamber comprises at least one chamber unit. Each chamber unit comprises a chamber and a pipeline channel. The chamber is internally provided with a dividing part which divides the inner space to a heated chamber and a backflow chamber. The dividing part is provided with at least one micro-fine channel. Two ends of the pipeline channel are respectively communicated with the heated chamber and the backflow chamber. The position of the heated chamber corresponds with a heat source. The dividing part has the functions of reducing heat energy loss which is transmitted from the heated chamber to the backflow chamber, so as to generate an enough temperature difference, furthermore generate different saturated vapor pressure, and therefore a pressure difference is generated between the heated chamber and the backflow chamber for driving gas to flow from the heated chamber to the backflow chamber; and utilizing a capillary pressure function for making liquid in the backflow chamber flow back to the heated chamber for being heated and evaporated, thereby realizing unidirectional flow circulation, and furthermore improving a heat exchange effect and a heat radiation effect.

Description

technical field [0001] The invention relates to a heat dissipation device for electronic products, in particular to a liquid-gas split flow heat exchange cavity. Background technique [0002] Most of the cooling devices of electronic products in the prior art are applied to heat pipes, which include a pipeline channel, and the pipeline channel includes an evaporation section and a condensation section. The evaporation section has a liquid (working fluid). After the liquid is evaporated into a gas, the gas moves from the evaporation section to the condensation section in the pipeline channel, and the gas will gradually become a liquid due to heat exchange loss during the process of moving in the pipeline channel, and the liquid passes through the tube wall Capillary structure, and return to the evaporation section along the original path, and then be heated again to evaporate into gas, so that the heat from the evaporation section can be successfully taken out. [0003] Howe...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 吴安智陈志伟刘昊
Owner AURAS ELECTRONICS SCI & TECH IND KUNSHAN