Temperature detection device of polishing interface and utilization of temperature signals in chemically mechanical polishing process

Abstract

The invention provides a device for detecting temperature of a polishing interface in real time with high precision on the premise of not influencing a polishing technology process, ad also provides a method for using detected temperature signals to perform polishing endpoint judgment and polishing process monitoring. The temperature detection device consists of a temperature sensor, a signal processing module, a conductive slip ring, a signal receiving device, a power supply and leads connecting all the components. A temperature sensing area of the temperature sensor is in direct contact with the reverse side of a polished workpiece, a weak signal output by the sensor is processed by the signal processing module and then transmitted to the signal receiving device through the conductive slip ring, and then the signal receiving device carries out operation such as collection, processing and display of the signal. When another material layer is removed from a material layer of the polished workpiece, a polishing endpoint can be judged according to a situation of a change of the temperature of the polishing interface. The temperature of the polishing interface is compared with a normal temperature range of a polishing interface under the same technological parameters, and thus whether a machining process is normal or not can be judged.

Description

technical field [0001] The patent of the present invention relates to a device that can detect the temperature of the polishing interface in real time with high precision without affecting the polishing process. The present invention also relates to a method of using the detected temperature signal to judge the polishing end point and monitor the polishing process. Background technique [0002] The material removal rate and surface quality in chemical mechanical polishing are affected by many factors, among which the polishing interface temperature is one of the main factors. An increase in temperature will increase the activity of the polishing fluid, thereby speeding up the chemical reaction and improving the material removal rate; at the same time, an increase in temperature may also lead to a decrease in the pH value of the polishing fluid and agglomeration of abrasive particles in the polishing fluid. In addition, the increase in temperature will reduce the elasticity a...

AI Technical Summary

Problems solved by technology

This method has been studied by scholars at home and abroad, but most of the methods used to detect temperature use non-contact methods, such as infrared temperature measurement. As mentioned above, non-contact temperature measurement methods have low accuracy. And the required equipment costs are higher

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