Stacked module heat radiation structure and manufacturing method thereof

Abstract

The invention discloses a stacked module heat radiation structure and a manufacturing method thereof. Second tin balls are welded on the lower surface of a lower packaging substrate. A third chip is fixed at the middle position of the upper surface of the lower packaging substrate. An upper packaging substrate is arranged above the lower packaging substrate. The middle position of the upper packaging substrate is provided with a window. First tin balls are welded on the lower surface of the upper packaging substrate. The first tin balls contact with the upper surface of the lower packaging substrate. The upper surface of the upper packaging substrate is provided with a plastic sealing member. A first chip is fixed on the upper surface of the upper packaging substrate at an inner position which corresponds with the plastic sealing member through first sealing glue. The projection of the base of a heat radiating plate penetrates through the window of the upper packaging substrate and is fixed with the upper surface of the third chip. According to the stacked module heat radiation structure, thermal resistance is reduced through the heat radiating plate structure, and a problem of overhigh temperature of the PoP can be effectively prevented.

Description

technical field [0001] The invention discloses a stacked module heat dissipation structure, and also discloses a manufacturing method of the stacked module heat dissipation structure, which belongs to the technical field of chip packaging. Background technique [0002] PoP (Package on Package) is a typical three-dimensional packaging solution, which can integrate logic chips and memory chips at the same time, and has become an important part of the handheld device market that is constantly pursuing smaller and thinner devices. Compared with the packaging form of chip stacking, the advantage of PoP packaging is that each device can be tested separately before assembly, which ensures a higher yield rate and the total stacking assembly cost can be minimized. At the same time, there is greater freedom in the choice of device combinations, and it is the preferred assembly solution for mobile phones, digital cameras and other products. [0003] However, PoP packaging usually adop...

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Problems solved by technology

[0003] However, PoP packaging usually adopts a two-layer package stacking structure. This vertical stacking makes the PoP package structure more complicated, and the air fluidity between the upper and lower packages becomes poor. The heat dissipation of the PoP package is mainly through the upper package. and the bottom substrate as the main path, resulting in poor heat dissipation performance of the PoP package

Especially in today's high-frequency mobile devices, the continuous increase of chip power consumption makes the heat dissipation problem of PoP more serious, and it is easy to cause the temperature of the chip in the package to be too high and exceed the requirements of thermal specifications.

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