Stacked module heat radiation structure and manufacturing method thereof
A heat dissipation structure and module technology, which is applied in the production of stacked module heat dissipation structure and the field of stacked module heat dissipation structure, can solve the problems of high chip temperature in the package, exceeding thermal specifications, complex structure, etc., and achieve easy operation and thermal resistance. Reduced, easy-to-step effects
Inactive Publication Date: 2015-09-09
NAT CENT FOR ADVANCED PACKAGING
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Abstract
The invention discloses a stacked module heat radiation structure and a manufacturing method thereof. Second tin balls are welded on the lower surface of a lower packaging substrate. A third chip is fixed at the middle position of the upper surface of the lower packaging substrate. An upper packaging substrate is arranged above the lower packaging substrate. The middle position of the upper packaging substrate is provided with a window. First tin balls are welded on the lower surface of the upper packaging substrate. The first tin balls contact with the upper surface of the lower packaging substrate. The upper surface of the upper packaging substrate is provided with a plastic sealing member. A first chip is fixed on the upper surface of the upper packaging substrate at an inner position which corresponds with the plastic sealing member through first sealing glue. The projection of the base of a heat radiating plate penetrates through the window of the upper packaging substrate and is fixed with the upper surface of the third chip. According to the stacked module heat radiation structure, thermal resistance is reduced through the heat radiating plate structure, and a problem of overhigh temperature of the PoP can be effectively prevented.
Application Domain
Semiconductor/solid-state device detailsSolid-state devices +2
Technology Topic
Heat sinkRadiation +2
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PUM
Property | Measurement | Unit |
Thickness | 0.1 ~ 1.0 | mm |
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