Unlock instant, AI-driven research and patent intelligence for your innovation.

MEMS (micro-electro-mechanical system) microphone

A microphone and integrated technology, applied in the direction of sensors, electrical components, etc., can solve the problems of high cost and difficulty, achieve the effect of improving performance and improving signal-to-noise ratio

Inactive Publication Date: 2015-09-09
GOERTEK INC
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the requirements for the signal-to-noise ratio of MEMS microphone products are getting higher and higher. In theory, this goal can be achieved by increasing the capacitance area of ​​the MEMS chip, but this requires re-development, design, and production of a new MEMS chip. Cost and very difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MEMS (micro-electro-mechanical system) microphone
  • MEMS (micro-electro-mechanical system) microphone
  • MEMS (micro-electro-mechanical system) microphone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0027] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0028] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, techniques, methods and devices should be considered part of the description.

[0029] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have differen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an MEMS (micro-electro-mechanical system) microphone, comprising a circuit board, a support part disposed on the circuit board, an integrated MEMS chip disposed above the support part, and a shell. The circuit board and the shell form a chamber. The support part and the integrated MEMS chip are packaged in the chamber. The integrated MEMS chip comprises a first MEMS unit and a second MEMS unit. The circuit board is provided with a first through hole. The support part is provided with a second through hole corresponding to the first MEMS unit and a third through hole corresponding to the second MEMS unit. The first through hole is located between the second through hole and the third through hole. The first, second and third through holes are communicated with one another, forming a branched sound hole. The MEMS microphone has the advantages that the area of detection capacitors is enlarged via the existing MEMS unit and the signal-to-noise ratio of the MEMS microphone is increased.

Description

technical field [0001] The invention relates to a MEMS microphone. Background technique [0002] MEMS microphone is an acoustic-electric transducer manufactured by micromachining technology, which has the characteristics of small size, good frequency response characteristics, and low noise. With the miniaturization and thinning of electronic devices, MEMS microphones are more and more widely used in these devices. [0003] MEMS microphone products include a MEMS chip based on capacitance detection and an ASIC chip. The capacitance of the MEMS chip will change accordingly with the input sound signal, and then use the ASIC chip to process and output the changed capacitance signal. sound pickup. MEMS chips usually include a substrate with a back cavity, and a parallel plate capacitor composed of a back plate and a diaphragm arranged above the substrate. The diaphragm receives external sound signals and vibrates, so that the parallel plate capacitor generates a changing electr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04R9/04
Inventor 刘文涛袁兆斌
Owner GOERTEK INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com