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Mems thermally induced vibration self-adaptive cooling method, actuator and processing method

A technology of heat dissipation method and processing method, which is applied in the direction of electric solid device, semiconductor device, metal material coating process, etc., to achieve the effect of small structure, good heat dissipation effect and light weight

Active Publication Date: 2017-06-23
ZHEJIANG UNIV
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Problems solved by technology

[0005] In order to overcome the deficiencies of the existing macroscopic synthetic jet actuator technology in the field of chip heat dissipation, the present invention provides MEMS thermally induced vibration self-adaptive heat dissipation method, actuator and processing method

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  • Mems thermally induced vibration self-adaptive cooling method, actuator and processing method

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Embodiment Construction

[0021] MEMS devices have the characteristics of small size, light weight, and low power consumption, which bring the following advantages to actuators based on MEMS technology: (1) Actuators with consistent performance can be obtained through batch processing, which can meet the high spatial resolution of flow control technology , high sensitivity, and high response requirements; (2) It is easy to realize the system integration of sensors, circuits and actuators, which improves the reliability and stability of the system; (3) It is easy to realize the array of actuators and realize multiple actuators The cooperative work overcomes the shortage of a single exciter with low energy. Therefore, synthetic jet technology based on MEMS technology will bring considerable prospects to the heat dissipation of large computer chassis and chips.

[0022] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0023] like figu...

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Abstract

The invention discloses a MEMS heat-induced vibration self-adaptive heat dissipation method, an exciter and a processing method. The heat dissipation method uses heat to drive the beam of the MEMS exciter to vibrate. The vibration of the beam changes the flow characteristics of the heat transfer surface and expands the temperature gradient. Thereby heat dissipation is realized. The advantage of this heat dissipation method is that it does not require external excitation, nor does it require an external control switch, but uses the waste heat of the heat source to drive and perform adaptive heat dissipation. A new path.

Description

technical field [0001] The invention relates to a MEMS heat-induced vibration self-adaptive heat dissipation method, an exciter and a processing method, which can be widely used in the field of heat dissipation of large chassis and chips. Background technique [0002] The continuous and rapid development of supercomputers has brought revolutionary development to many major national projects, which in turn has affected our national economy and people's livelihood, but at the same time it has also brought about a sharp increase in energy consumption, and it occupies an increasing share in national energy consumption. From 2005 to 2010, the energy consumption of data centers around the world increased by 56%. In 2010, the energy consumption of data centers reached 237TWh, accounting for 1.3% of the total electricity consumption in that year. Among them, the cooling system accounts for as high as 20-50% of the energy consumption of the entire data center. In China, the "Tianhe-...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/467H01L23/367B81C1/00
Inventor 吴昌聚陈伟芳
Owner ZHEJIANG UNIV
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