Heat radiating device

Abstract

The invention provides a heat radiating device which integrally has a planar structure. The heat radiating device comprises an insulating board, a conductive board and a power supply. The power supply is connected with an external power supply for supplying high voltage to the heat radiating device. The insulating board comprises a metal filament. The power supply comprises an anode and a cathode. The anode is connected with the metal filament of the insulating board. The cathode is connected with the conductive board. The insulating board abuts against the conductive board. After the power supply supplies electric power to the heat radiating device, the metal filament ionizes adjacent air molecules for forming carbonium ions. The conductive board attracts the carbonium ions. A large amount of carbonium ions quickly move to the conductive board with negative electrons, and forced convection of air is formed, thereby realizing heat radiation.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device which generates forced convection of air to enhance the heat dissipation effect. Background technique [0002] Most of the 3C or consumer electronics products on the market today are designed towards the trend of thinner and lighter, and more and more functions are added in the limited space, which leads to higher and higher chip power consumption. As a result, a large amount of heat energy remains inside the product and cannot be discharged, which reduces the performance and life of the components. [0003] The solution to the lack of heat dissipation in general thin and light electronic products is nothing more than adding heat sinks, heat-conducting adhesives and other heat-dissipating components. However, due to space constraints, fans cannot be added. They all use natural convection to dissipate heat, and forced convection cannot be used to take heat out...

AI Technical Summary

Problems solved by technology

[0002] Most of the 3C or consumer electronics products on the market today are designed towards the trend of thinner and lighter, and more and more functions are added in the limited space, which leads to higher and higher chip power consumption. As a result, a large amount of heat energy remains inside the product and cannot be discharged, which reduces the performance and life of the components

[0003] The solution to the lack of heat dissipation in general thin and light electronic products is nothing more than adding heat sinks, heat-conducting adhesives and other heat-dissipating components. However, due to space constraints, fans cannot be added. They all use natural convection to dissipate heat, and forced convection cannot be used to take heat out of the product. external

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