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Silica release process

A technology of silicon dioxide and technology, applied in metal material coating technology, technology for producing decorative surface effects, decorative art, etc., can solve the problems of dangerous and high cost in production equipment workshops, reduce production costs and improve response Efficiency, the effect of avoiding microstructure adhesion

Active Publication Date: 2018-11-06
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] A large amount of water will be generated during this process. Once the water vapor condenses, it will cause adhesion of the fine structure. In order to avoid subsequent adhesion, it is necessary to continuously inject methanol gas, and this type of alcohol gas is flammable and explosive. There is a certain degree of danger to the production equipment workshop, and the cost will be relatively high

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  • Silica release process
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Embodiment Construction

[0026] Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same numbers will be used throughout the drawings to refer to the same or like parts. In addition, although the terms used in the present invention are selected from well-known and commonly used terms, some terms mentioned in the description of the present invention may be selected by the applicant according to his or her judgment, and the detailed meanings thereof are set forth herein described in the relevant section of the description. Furthermore, it is required that the present invention be understood not only by the actual terms used, but also by the meaning implied by each term.

[0027] first reference figure 1 , The silicon dioxide release process 100 of the present invention ma...

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Abstract

The invention discloses a brand novel silicon dioxide release technology to inhibit the adhesion of a fine structure. The silicon dioxide release technology comprises the following steps: a, introducing a gas into a technological cavity; b, introducing an HF gas into the technological cavity, wherein the HF gas reacts with silicon dioxide in the technological cavity under the effect of the catalytic gas; and c, introducing an F2 gas or an XeF2 gas into the technological cavity so as to react with H2O in the technological cavity. The final product provided by the technology does not contain H2O, so that the problem of probably caused adhesion of the fine structure is prevented.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a silicon dioxide release process. Background technique [0002] At present, the development of microelectromechanical system (MEMS) manufacturing process gradually appears gas-phase HF etching of silicon dioxide to realize the release of some special structures, such as cantilever beams, gyroscopes and CMOS devices. [0003] The mainstream dry release process needs to first pass methanol, or ethanol or isopropanol or other alcohol gas to wet the sample surface and act as a catalyst in the reaction, and then pass anhydrous HF gas to react with silica. [0004] A large amount of water will be generated during this process. Once the water vapor condenses, it will cause adhesion of the fine structure. In order to avoid subsequent adhesion, it is necessary to continuously inject methanol gas, and this type of alcohol gas is flammable and explosive. There is a certain degree o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
Inventor 贾照伟王坚王晖
Owner ACM RES SHANGHAI