Oxidation device of cuprous ions in acid etching liquid for printed circuit board

Abstract

The invention provides an oxidation device of cuprous ions in acid etching liquid for a printed circuit board. The oxidation device comprises a housing, a fixed disk, a cover plate, a spray pipe, a spray disk, a dispersion disk and a water inlet pipe, wherein the fixed disk and the cover plate are arranged at the lower end and the upper end of the housing respectively; the spray pipe is connected with the spray disk, and contained in the housing; the spray pipe is connected with the water inlet pipe by the dispersion disk; an air inlet penetrating through the upper surface and the lower surface of the cover plate is formed in the center of the cover plate; and the spray disk comprises a nozzle connected with the dispersion disk, and air holes surrounding the nozzle. According to the structure, the acid etching liquid flows into the nozzle from the water inlet pipe and is sprayed into the spray pipe, an oxidizing gas enters the spray pipe from the air inlet under the action of negative pressure, the oxidizing gas and the acid etching liquid are converged in the spray pipe and mixed fully to undergo a chemical reaction, so that the cuprous ions in the acid etching liquid are oxidized into bivalent copper ions to realize cuprous ion oxidation and the recycle of the oxidizing gas in regeneration treatment of the acid etching liquid.

Description

technical field [0001] The invention belongs to the technical field of circuit board acid etching solution regeneration, and in particular relates to a printed circuit board acid etching solution cuprous ion oxidation device for oxidizing cuprous ions generated in acid etching solution of printed circuit boards into divalent cupric ions . Background technique [0002] Printed circuit board (PCB board), also known as printed circuit board, uses an insulating board as the base material and cuts it to a certain size. At least one conductive pattern is attached to it as the substrate, and holes (such as component holes) are provided on the upper part of the substrate. , strong holes, metal holes and other mounting holes), used to replace the chassis of electronic components installed in the past, and realize the electrical connection between component pins through conductive patterns, pads and metallized vias on the substrate. As the most basic and core component of electronic ...

AI Technical Summary

Problems solved by technology

[0005] In order to reduce the waste of resources and environmental pollution, the industry often uses the method of regeneration of electrolytic etching solution, but the anode must produce oxidative gas during the electrolytic treatment process. If it is not recycled, it will not only cause economic waste. , causing secondary pollution to the environment

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