Production process of a high-strength anti-sag mirror plate

A production process and anti-sag technology, which is applied in the direction of circuit substrate materials, processing steps, electrical components, etc., can solve the problem that the coating sintering process has not been effectively improved, the improvement of the coating formula has not achieved ideal results, and the impact on the expansion of the mirror plate Shrinkage and other issues to achieve the effect of overcoming adverse effects, getting rid of environmental and equipment pollution, and smooth distribution

Active Publication Date: 2017-12-29
SUZHOU JIAMING MACHINERY MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The biggest difference between the mirror board and the ordinary insulating board is that there is a special coating on the surface, which has a great influence on the performance of the mirror board. In the lamination process, the performance requirements of the mirror board are very high. During operation, both high temperature heat (greater than 300°C) and strong pressure (greater than 50MPa) are generated, which requires the mirror plate to have excellent thermal pressure resistance, that is, the mirror plate needs to have a very high limit temperature resistance And the ultimate pressure resistance, and, more importantly, the surface of the mirror plate must still be very smooth and smooth after repeated hot pressing, without depressions on the surface, and no expansion and contraction, while currently in the prior art This requirement cannot be realized yet. Generally, after the mirror plate of the prior art can be used about 150 times at normal temperature, the surface begins to be sunken, causing the mirror plate to fail, and it can only be used about 60 times at high temperature. fail
Another reason why this requirement cannot be achieved in the existing technology is that the process of preparing it has not been deeply optimized, including: the pretreatment of the substrate is mainly treated by chemical methods, which not only causes pollution, but also produces strong stress , which seriously affects the expansion and contraction rate of the mirror plate; the improvement of the coating formula has not achieved ideal results; the sintering process of the coating has not been effectively improved

Method used

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  • Production process of a high-strength anti-sag mirror plate
  • Production process of a high-strength anti-sag mirror plate
  • Production process of a high-strength anti-sag mirror plate

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Embodiment Construction

[0025] The present invention will be further described in detail below in conjunction with the embodiments, so that those skilled in the art can implement it with reference to the description.

[0026] This case proposes a production process of a high-strength anti-sag mirror plate of an embodiment, including:

[0027] S1: Using the steel plate as the substrate, sandblasting the steel plate;

[0028] S2: brushing the paint on the surface of the steel plate;

[0029] S3: freezing the coated steel plate at -2-0°C for 5-6 minutes;

[0030] S4: Sintering the steel plate at high temperature;

[0031] S5: grinding;

[0032] Among them, in S2, the paint includes the following materials:

[0033]

[0034] In S4, the sintering conditions are: in an inert gas atmosphere, from 0 to 30 minutes, the temperature is raised to 150°C at a constant speed; for 30 minutes to 1h, the temperature is constant at 150°C; , constant temperature at 650°C; after 5h, cool down to 25°C naturally. ...

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Abstract

The invention discloses a production technology of a high-strength recess-preventing mirror plate. The production technology of the high-strength recess-preventing mirror plate comprises the following steps of (S1) performing sand blasting on a steel plate; (S2) coating surfaces of the steel plate by using a coating; (S3) placing the steel plate in an environment at the temperature of minus 2 DEG C to 0 DEG C and freezing the steel plate for 5-6 minutes; (S4) sintering; and (S5) grinding. The coating comprises the following raw materials in part by weight: 40-42 parts of barium oxide, 25-27 parts of calcium oxide, 20-22 parts of boric oxide, 14-16 parts of cobaltous oxide, 2-4 parts of manganese oxide, 2-4 parts of strontium oxide and 200 parts of water. The steel plate is sintered in inert gas, and when the steel plate is sintered for 0-30 minutes, the temperature of the steel plate rises to 150 DEG C at constant speed; when the steel plate is sintered for 30 minutes to 1 hour, heat of the steel plate is kept at the temperature of 150 DEG C; when the steel plate is sintered for 1 hour to 3 hours, the temperature of the steel plate rises from 150 DEG C to 650 DEG C at constant speed; when the steel plate is sintered for 3 hours to 5 hours, the heat of the steel plate is kept at 650 DEG C; and after the steel plate is sintered for 5 hours, the steel plate is cooled down naturally. The mirror plate which is produced by the technology in the scheme can be frequently used under the conditions of high temperature, high pressure and hot pressure and does not expand or shrink; surfaces of the mirror plate are flat and wear-resistant; and the mirror plate cannot be recessed.

Description

technical field [0001] The invention relates to a production process of an insulating board, in particular to a production process of a high-strength anti-sag mirror plate coated with a modified coating on the surface. Background technique [0002] When manufacturing the main base material of the circuit board (PCB), it is necessary to use a voltage machine to laminate multiple layers of different materials. The working principle of this voltage machine is to heat the processed glue through copper foil (or aluminum foil). Adhesive resin material, and press the multi-layer material by applying a certain pressure for at least half an hour, so as to make the circuit board base material, and in the process of pressing with an electric machine, due to cost considerations, a single pressing operation often needs to be done at the same time. Pressing multiple pieces of circuit board substrates, and in order to prevent multiple pieces of circuit board substrates from being affected ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/05
CPCH05K1/053H05K3/0011H05K2203/025H05K2203/111H05K2203/1131H05K2203/14
Inventor 沈金明
Owner SUZHOU JIAMING MACHINERY MFG
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