A kind of transfer device of vcp production line

Abstract

The invention discloses a material transfer device of a VCP production line, which comprises a frame, a control device, a stepping motor for driving, a main transmission chain device arranged at the lower part of the frame, fixed on the upper part of the frame and connected with the An auxiliary transmission chain device arranged parallel to the main transmission chain device, a number of flybars and flybar seats for fixing copper plates are evenly distributed on the main transmission chain device; The lifting device is driven by a lifting motor; the stepping motor, lifting motor, and induction switch are connected to the control device. The material transfer device of the VCP production line disclosed by the invention aims to realize the consistent movement of the copper plate between the copper plating cylinder and the cleaning tank, realize continuous operation, improve production efficiency, reduce labor intensity, and at the same time facilitate the realization of automatic control.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing equipment, in particular to a material transfer device of a VCP production line. Background technique [0002] The fully automatic vertical continuous electroplating line is currently the most advanced electroplating equipment in China. It is mainly divided into two types in China, one is the gantry line and the other is the ring line; the main transmission device of the ring line adopts the flybar type, and the flybar bearing Supported on the circular guide track, the flybar is fixed with an electroplating clip for clamping the single-piece substrate, and the flybar is driven by other power systems to drive the substrate to move forward along the circular guide track. In the existing process, the copper plating cylinder and the cleaning tank are completely separated, and the copper plate must pass through at one time. In the middle, the copper plate must be raised and the...

AI Technical Summary

Problems solved by technology

In the existing process, the copper plating cylinder and the cleaning tank are completely separated, and the copper plate must pass through at one time. In the middle, the copper plate must be raised and then moved forward synchronously. When it reaches another cylinder, it must be Put it back to the original position to keep the end consistent without affecting the continued passage of the following boards. In the existing technology, the change of the position of the copper board needs to be realized by manpower, which is inefficient and labor-intensive, which is not conducive to the realization of automatic control.

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