Glue laying method for led display pcb board
A technology of LED display screen and PCB board, which is applied in the direction of equipment, electrical components, printed circuit manufacturing, etc., and can solve the problems of increasing product weight, wasting materials, and thickness of the bottom shell, etc.
Active Publication Date: 2018-08-14
HUBEI PHILISENSE ELECTRONICS EQUIP
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Problems solved by technology
In this process, the waterproof rubber ring (4) on the module needs to be completely attached to the box body and the waterproof rubber ring (4) on the back of the module needs to be pressed and deformed, so the bottom shell (3) of the module needs to With a certain strength, in order to form a closed space and complete the waterproof purpose on the back of the module, only the thickness of the bottom case (3) must be thickened, which wastes materials and increases the overall weight of the product
[0004] To sum up, the existing LED display glue filling process requires a thick bottom shell and consumes a lot of materials, which not only increases the weight of the product itself, but also reduces the permeability of the LED panel
Method used
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[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0026] The glue laying method of LED display screen PCB board that the present invention proposes comprises the following steps:
[0027] Step 1. Place the PCB board with the soldered components facing up on the material rack after soldering the electronic components;
[0028] Step 2, AB epoxy resin glue is modulated into transparent colloid, wherein the weight ratio of epoxy resin and curing agent is 9-12:1;
[0029] Step 3. Apply the prepared colloid evenly on the soldered electronic components of the PCB board;
[0030] Step 3. Place the glue-coated side of the PCB board upwards, place it on a horizontal shelf to avoid the flow of the glue, and wait for two to three hours for the glue to solidify;
[0031] Step 4. After the colloid applied on the PCB board is cured, apply the conformal paint on the unpaved position of the PCB boa...
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The invention relates to a glue applying method for a PCB of an LED display screen, and belongs to the processing technical field of PCBs. The method includes the steps: making one side, with welded components, of a PCB on which the electronic components are welded face upward, and placing the PCB on a material support; preparing AB epoxy resin glue to be a transparent viscous glue body, and evenly coating the prepared glue body on the electronic components that have been welded to the PCB; making the glued side of the PCB face upward, placing the PCB on a horizontal holding support, and waiting until solidification of the coated glue body; and painting unglued positions of the PCB with paint having three resistance functions after the coated glue body on the PCB is solidified. The glue applying method is easy and feasible. The PCB and a bottom case can be made to be hollow, so the weight of the bottom case is reduced, and an LED panel is more transparent.
Description
technical field [0001] The invention relates to the technical field of LED production, in particular to a method for laying glue on a PCB board of an LED display screen. Background technique [0002] The LED display screen is a screen that uses dot matrix modules or pixel units composed of light-emitting diodes to form an area display screen. It has the characteristics of high reliability, long service life, strong environmental adaptability, high price-performance ratio, and low cost of use. In the short ten years, it has rapidly grown into a mainstream product of flat panel display and has been widely used in the field of information display. [0003] At present, the development trend of LED display is mainly light, thin, and transparent, and it also takes into account the needs of waterproof and high density. The LED display in the prior art is generally used in the waterproofing process of the module using the glue filling process, such as figure 1 As shown, first inst...
Claims
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IPC IPC(8): H05K3/28G09F9/33
CPCG09F9/33H05K3/284H05K2203/0759
Inventor 姚波韬
Owner HUBEI PHILISENSE ELECTRONICS EQUIP