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Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production method

A resin composition, electron beam curing technology, applied in the direction of electric solid devices, semiconductor devices, circuits, etc., can solve the problems of lower reflectivity, shorter life of LED components, lower brightness, etc., and achieve the effect of excellent thermal deformation resistance

Inactive Publication Date: 2015-10-07
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the LED element generates heat when it emits light, in this type of LED lighting device, the reflector deteriorates due to the temperature rise of the LED element when the LED element emits light, and its reflectivity decreases, thereby reducing the brightness, causing the LED element to emit light. short lifespan, etc.

Method used

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  • Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production method
  • Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production method
  • Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production method

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Experimental program
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Effect test

Embodiment 1～16、 comparative example 1～3

[0149] As shown in the following Tables 2-1 to 2-4, various materials were blended and kneaded to obtain a resin composition.

[0150]It should be noted that, regarding the resin composition, various materials were blended using an extruder (Nippon Placon Co., Ltd. MAX30: die diameter 3.0 mm) and a granulator (Tongyo Seiki Manufacturing Co., Ltd. MPETC1). carried out to obtain a resin composition.

[0151] These compositions were press-molded under the conditions of 250° C., 30 seconds, and 20 MPa to a size of 750 mm×750 mm×thickness 0.2 mm to produce a molded article (1).

[0152] In addition, the above-obtained resin composition was placed on a silver-plated frame (thickness: 250 μm) using an injection molding machine Sodick TR40ERSodick (pre-molding type) so that thickness: 700 μm, external dimensions: 35mm×35mm, opening: 2.9mm×2.9 The molding was carried out in mm to obtain a resin frame molding (2) for reflectors. The conditions of the injection molding machine are as f...

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Abstract

The present invention involves an electron beam curable resin composition containing an olefin resin and a crosslinking agent. The crosslinking agent has a saturated or unsaturated ring structure, and at least one of the atoms forming at least one ring is bonded to an allylic substituent of any of an allyl group, a metallyl group, a linking group-mediated allyl group, and a linking group-mediated metallyl group. The electron beam curable resin composition is obtained by blending in more than 15 parts by mass to 40 parts by mass of the crosslinking agent with respect to 100 parts by mass of the olefin resin. The present invention further involves a reflector resin frame that uses the resin composition, a reflector, a semiconductor light-emitting device, and a molding method in which the resin composition is used.

Description

technical field [0001] The present invention relates to an electron beam curable resin composition, a resin frame for a reflector, a reflector, a semiconductor light-emitting device, and a method for producing a molded body. Background technique [0002] At present, as a method of mounting electronic components on a substrate, etc., it is possible to temporarily fix the electronic components on a substrate with flux dotted in a predetermined place, and then heat the substrate by infrared rays, hot air, etc. to melt the flux and fix the electronic components. The method of the part (reflow soldering method). This method can increase the mounting density of electronic components on the surface of the substrate. [0003] However, the heat resistance of the electronic parts currently used cannot be said to be sufficient. In particular, in the reflow soldering process using infrared heating, there are problems such as the temperature of the part surface locally rising and deform...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/02C08K3/00C08K5/12C08K5/3477C08L65/00H01L33/60
CPCH01L33/60C08G2261/135C08G2261/3324C08G2261/418C08G2261/724C08G2261/76C08K3/36C08K5/34924C08K7/14C08L23/02C08L65/00C08K3/22C08K2003/2241C08L2203/20C08L23/06C08L23/12C08L45/00H01L2924/181H01L2224/48091H01L2224/48247H01L2924/00012H01L2924/00014
Inventor 木村安希坂寄胜哉坂井俊之财部俊正天下井惠维小田和范大石惠关口毅川合研三郎桥本久留巳
Owner DAI NIPPON PRINTING CO LTD
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