Bottom filling method for preventing cold solder joint of BGA IC

An underfill and virtual soldering technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as poor effect and complex design, so as to improve production efficiency, enhance resistance to mechanical stress, and realize line The effect of body flow operation

Inactive Publication Date: 2015-10-14
SHENZHEN SKYWORTH RGB ELECTRONICS CO LTD
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Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide an underfill method for preventin

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  • Bottom filling method for preventing cold solder joint of BGA IC

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Embodiment Construction

[0026] The present invention provides an underfill method for preventing BGA IC solder joints. In order to make the purpose, technical solution and effect of the present invention clearer and more definite, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] see figure 1 , figure 1 A flow chart of a preferred embodiment of an underfill method for preventing BGA IC virtual soldering provided by the present invention, as shown in the figure, includes steps:

[0028] S101. Solder the IC on the PCB board on the SMT equipment, and ensure that the IC does not have a false soldering through inspection;

[0029] S102 , using capillary action and glue dispensing equipment to fill the gap between the IC and the PCBA with the filler, so that the IC and the PCBA are integrated.

[0030] The bottom filling method o...

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Abstract

The present invention discloses a bottom filling method for preventing a cold solder joint of BGA IC. The method comprises the steps of: soldering an IC on a PCB board and ensuring that the IC does not generate a cold solder joint by detection; and filling a filling rubber into a gap between the IC and PCBA by utilizing capillary action and a glue dispensing device to integrate the IC with the PCBA. According to the present invention, the IC and the PCBA are integrated in a glue filling manner, so that mechanical stress resistance of the IC can be strengthened; meanwhile the gap between the IC and the PCBA is eliminated and the thermal conductivity of the glue is extremely higher than that of air, so that the thermal stress of the IC can be significantly improved and the miniaturization of a machine core board can be implemented; and by using the bottom filling method, arrangement space of the PCB is not occupied, so that line production can be implemented and the soldering process is not influenced; by using an injection glue dispensing manner, the production efficiency can be effectively improved; furthermore, by using the bottom filling method, the cold solder joint can be detected in advance to prevent defective products from flowing into the subsequent process.

Description

technical field [0001] The invention relates to the field of BGA production, in particular to a bottom filling method for preventing BGA IC virtual soldering. Background technique [0002] With the continuous enhancement of the functions of flat-panel TVs, the number of pins of BGA (Ball Grid Array, PCB with ball grid array structure) is also increasing, and the power consumption and heat generation are also increasing. The requirements of the process are also constantly increasing. At the same time, due to the high penetration rate of TV, consumers have higher and higher requirements for the quality of TV. [0003] In the prior art, the commonly used method to prevent the false soldering of the BGA IC of the flat panel TV is to add two positioning posts on the heat sink for traction, so as to prevent the deformation of the PCB board to prevent the soldering. This method is to weld and fix the positioning column and the PCB board, which can prevent the solder joints from b...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L21/66
CPCH01L22/12H01L24/83H01L2224/83862H01L2224/83908
Inventor 王小青周洪贵
Owner SHENZHEN SKYWORTH RGB ELECTRONICS CO LTD
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